Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Bernier, William E, Henderson, Donald W, Spalik, James, Paquin, Isabelle
Year of Publication 26.07.2005
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Year of Publication 26.07.2005
Patent
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Bernier, William E, Henderson, Donald W, Spalik, James, Paquin, Isabelle
Year of Publication 01.07.2003
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Year of Publication 01.07.2003
Patent