Development of a Stretchable and Removable Electrical Interconnection Solution for Ultra-Thin Electronic Components
Despax-Ferreres, Auriane, Tiquet, Pascal, Souriau, Jean-Charles, Jousseaume, Vincent, De Girolamo, Julia
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
Gougeon, Julie, Feautrier, Celine, Souriau, Jean-Charles, Franiatte, Remi, Deschaseaux, Edouard, Mendizabal, Laurent, Treguer-Delapierre, Mona
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Flexible Fan-Out Wafer Level Packaging of Ultra-Thin Dies
Souriau, Jean-Charles, Castagne, Laetitia, Ladner, Carine, Franiatte, Remi, Guillaume, Jennifer
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Wafer Level Integration of Thin Silicon Bare Dies Within Flexible Label
Souriau, Jean-Charles, Itawi, Ahmad, Castagne, Laetitia
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Low-temperature silver sintering by colloidal approach
Bronchy, Maxime, Souriau, Jean-Charles, Heintz, Jean-Marc, Feautrier, Celine, Henry, David, Duguet, Etienne, Mendizabal, Laurent, Simon, Gilles, Treguer-Delapierre, Mona
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Biophysicochemical evaluation of passivation layers for the packaging of silicon microsystems in medical devices
Morales, Jorge Mario Herrera, Souriau, Jean-Charles, Ratel, David, Berger, Francois, Simon, Gilles
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems
Coudrain, Perceval, Garnier, Arnaud, Castagné, Laetitia, Plihon, Aurélia, Vélard, Rémi, Franiatte, Rémi, Souriau, Jean-Charles, Pignol, Jeanne, Darrambide, Célia, Ollier, Emmanuel
Published in ECS transactions (30.09.2022)
Published in ECS transactions (30.09.2022)
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Journal Article
Implantable device including a MEMS accelerometer and an ASIC chip encapsulated in a hermetic silicon box for measurement of cardiac physiological parameter
Souriau, Jean-Charles, Castagne, Laetitia, Parat, Guy, Simon, Gilles, Amara, Karima, D'hiver, Philippe, Dal Molin, Renzo
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon Carrier
Souriau, J-C., Poulain, C., Castagne, L., Ladner, C., Hilt, T., Franiatte, R., Mermin, D., David, N.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
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Journal Article
Characterization of a hermetic silicon box fitted in a cardiac lead in order to measure the endocardial acceleration signal
Souriau, Jean-Charles, Castagne, Laetitia, Parat, Guy, Nicolas, Pierre, Charvet, Pierre-Louis, Simon, Gilles, Amara, Karima, D'hiver, Philippe, Boutaud, Bertrand, Dal Molin, Renzo
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding
Temporary bonding for Chips In Wafer processing
Souriau, J.-C., Jouve, A., Sillon, N.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
3D multi-stacking of thin dies based on TSV and micro-inserts interconnections
Souriau, Jean-Charles, Castagne, L., Liotard, J., Inal, K., Mazuir, J., Le Texier, F., Fresquet, G., Varvara, M., Launay, N., Dubois, B., Malia, T.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Chip In Wafer for Integrated System
Souriau, J.-C., Faivre, M.-E., Sillon, N.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Development of a Flexible Label Integrating a Silicon Bare Die
Ahmad, Itawi, Jean-Charles, Souriau
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
3D Integration Technology Activities at CEA-LETI Minatec
Scannell, Mark, Poupon, Gilles, Di Cioccio, Lea, Henry, David, Souriau, Jean-Charles, Grossi, Francois, Leduc, Patrick, Battude, Perrine, Vinnet, Maud, Guegen, Pierric, Clavalier, Laurent, Sillon, Nicolas
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
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Journal Article