Search Results - "SOTO GONZALEZ, JAVIER" :: K.UTB vyhledávací portál

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SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS AND METHODS OF MAKING SAME

by SOTO GONZALEZ JAVIER, BRAUNISCH HENNING, ELSHERBINI ADEL A, LIFF SHAWNA M
Year of Publication 30.04.2024

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리소그래픽으로 정의된 비아들 내의 스케일러블 임베디드 실리콘 브리지 비아 필러들 및 그 제조 방법들

by SOTO GONZALEZ JAVIER, BRAUNISCH HENNING, ELSHERBINI ADEL A, LIFF SHAWNA M
Year of Publication 31.07.2019

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고밀도 상호접속을 갖는 반도체 패키징

by SOTO GONZALEZ JAVIER, FALCON JAVIER A, SWAN JOHANNA M, BRAUNISCH HENNING, ELSHERBINI ADEL A, LIFF SHAWNA M, BHARATH KRISHNA
Year of Publication 09.05.2019

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팬 아웃 스케일링을 위한 필러 및 비아 접속부를 구비한 고밀도 상호접촉 층을 가진 패키지 기판

by ALEKSOV ALEKSANDAR, MAY ROBERT ALAN, SOTO GONZALEZ JAVIER, BOYAPATI SRI RANGA SAI, LIM KWANGMO CHRIS, PIETAMBARAM SRINIVAS V, DARMAWIKARTA KRISTOF KUWAWI
Year of Publication 08.08.2019

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센서 통합 패키지 제조 방법 및 이로부터 형성된 구조물

by SOTO GONZALEZ JAVIER, KONG LAY WAI, SALAMA ISLAM A, LEE KYU OH, ZHOU ZHENG, OSTER SASHA N, EID FERAS
Year of Publication 29.11.2017

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BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

by ALEKSOV ALEKSANDAR, ISLAM RAFIQUL, ANDRYUSHCHENKO TATYANA, STAINES DAVID, SENEVIRATNE DILAN, SOTO GONZALEZ JAVIER, PIETAMBARAM SRINIVAS, KOBRINSKY MAURO, LEVANDER ALEJANDRO
Year of Publication 24.02.2016

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MULTICHIP INTEGRATION WITH THROUGH SILICON VIA(TSV) DIE EMBEDDED IN PACKAGE

by RAORANE DIGVIJAY A, LI YONGGANG, SOTO GONZALEZ JAVIER, MANEPALLI RAHUL N
Year of Publication 21.11.2014

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Substrate with embedded stacked through-silicon via die

by Jomaa, Houssam, Gonzalez, Javier Soto
Year of Publication 31.08.2021

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SUBSTRATE WITH EMBEDDED STACKED THROUGH-SILICON VIA DIE

by JOMAA, Houssam, GONZALEZ, Javier Soto
Year of Publication 16.01.2020

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Substrate with embedded stacked through-silicon via die

by Jomaa, Houssam, Gonzalez, Javier Soto
Year of Publication 29.10.2019

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Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages

by Jen, Wei-Lun K, Cho, Steve S, Soto Gonzalez, Javier, Gamba, Jason M, Ibrahim, Tarek A, Manepalli, Rahul N
Year of Publication 20.08.2024

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Semiconductor packaging with high density interconnects

by Liff, Shawna M, Elsherbini, Adel A, Soto Gonzalez, Javier, Braunisch, Henning, Bharath, Krishna, Falcon, Javier A, Swan, Johanna M
Year of Publication 23.01.2024

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STRUCTURAL BRACE FOR ELECTRONIC CIRCUIT WITH STRETCHABLE SUBSTRATE

by Aleksov Aleksandar, Soto Gonzalez Javier
Year of Publication 30.11.2017

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STRUCTURAL BRACE FOR ELECTRONIC CIRCUIT WITH STRETCHABLE SUBSTRATE

by SOTO GONZALEZ, Javier, ALEKSOV, Aleksandar
Year of Publication 30.11.2017

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PANEL LEVEL PACKAGING FOR MULTI-DIE PRODUCTS INTERCONNECTED WITH VERY HIGH DENSITY (VHD) INTERCONNECT LAYERS

by BOYAPATI, Sri Ranga Sai, SOTO GONZALEZ, Javier, MAY, Robert A, PIETAMBARAM, Srinivas V, DARMAWIKARTA, Kristof, LIM, Kwangmo
Year of Publication 12.10.2023

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METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

by SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 04.10.2023

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Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers

by May, Robert A, Darmawikarta, Kristof, Soto Gonzalez, Javier, Pietambaram, Srinivas V, Lim, Kwangmo, Boyapati, Sri Ranga Sai
Year of Publication 22.08.2023

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