Stacked integrated circuit package-in-package system
SONG SUNGMIN, LEE SEONGMIN, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN, YIM CHOONG BIN
Year of Publication 27.01.2009
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Year of Publication 27.01.2009
Patent
Stacked integrated circuit package-in-package system
Song, Sungmin, Yim, Choong Bin, Lee, SeongMin, Lim, Jaehyun, Yang, Joungin, Park, DongSam
Year of Publication 27.01.2009
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Year of Publication 27.01.2009
Patent
Stacked integrated circuit package-in-package system
SONG SUNGMIN, LEE SEONGMIN, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN, YIM CHOONG BIN
Year of Publication 08.05.2008
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Year of Publication 08.05.2008
Patent
Stacked integrated circuit package-in-package system
SONG SUNGMIN, LEE SEONGMIN, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN, YIM CHOONG BIN
Year of Publication 25.12.2007
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Year of Publication 25.12.2007
Patent
Stacked integrated circuit package-in-package system
Song, Sungmin, Yim, Choong Bin, Lee, Seongmin, Lim, Jaehyun, Yang, Joungin, Park, Dongsam
Year of Publication 25.12.2007
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Year of Publication 25.12.2007
Patent
Stacked integrated circuit package-in-package system with recessed spacer
SONG SUNGMIN, LEE SEONGMIN, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN, YIM CHOONG BIN
Year of Publication 20.11.2007
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Year of Publication 20.11.2007
Patent
Stacked integrated circuit package-in-package system with recessed spacer
Yim, Choong Bin, Song, Sungmin, Lee, SeongMin, Lim, Jaehyun, Yang, Joungin, Park, DongSam
Year of Publication 20.11.2007
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Year of Publication 20.11.2007
Patent
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH RECESSED SPACER
SONG SUNGMIN, LEE SEONGMIN, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN, YIM CHOONG BIN
Year of Publication 23.08.2007
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Year of Publication 23.08.2007
Patent
Stacked integrated circuit package-in-package system
SONG SUNGMIN, LEE SEONGMIN, YIM CHOONG B, LIM JAEHYUN, PARK DONGSAM, YANG JOUNGIN
Year of Publication 12.07.2007
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Year of Publication 12.07.2007
Patent