FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
LEE, Youngsun, SONG, Chagyu, PARK, Kookjin, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 04.04.2024
Get full text
Year of Publication 04.04.2024
Patent
SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE COMPRISING SAME
SEO, Hoyeon, SONG, Chagyu, SHIN, Dongjun, PARK, Kookjin, RA, Jaeyeon, PARK, Chulwoo, LEE, Jongbum, JIN, Gyeongmin
Year of Publication 14.12.2023
Get full text
Year of Publication 14.12.2023
Patent
Copper foil exposed structure for thin PoP warpage improvement
YeSeul Ahn, JinSeong Kim, ChaGyu Song, GyuWan Han, JuHoon Yoon, ChoonHeung Lee
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Get full text
Conference Proceeding
PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME
KIM, Jichul, SONG, Chagyu, SONG, Yongjae, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 19.08.2021
Get full text
Year of Publication 19.08.2021
Patent
FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
LEE, Youngsun, SONG, Chagyu, PARK, Kookjin, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 22.05.2024
Get full text
Year of Publication 22.05.2024
Patent
PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME
KIM, Jichul, SONG, Chagyu, SONG, Yongjae, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 04.10.2023
Get full text
Year of Publication 04.10.2023
Patent
PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME
KIM, Jichul, SONG, Chagyu, SONG, Yongjae, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 14.12.2022
Get full text
Year of Publication 14.12.2022
Patent
PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME
KIM, Jichul, SONG, Chagyu, SONG, Yongjae, RA, Jaeyeon, JIN, Gyeongmin
Year of Publication 01.12.2022
Get full text
Year of Publication 01.12.2022
Patent