FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
Song, Wil Choon, Sir, Jiun Hann, Koh, Boon Ping, Lim, Min Suet, Goh, Eng Huat, Yong, Khang Choong
Year of Publication 03.10.2019
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Year of Publication 03.10.2019
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MULTI-USE PACKAGE ARCHITECTURE
Yao, Jimin, Sir, Jiun Hann, Stamey, Richard C, Lim, Min Suet, Goh, Eng Huat, Lim, Chu Aun
Year of Publication 19.09.2019
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Year of Publication 19.09.2019
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Three capacitor stack and associated methods
Chua, Han Kung, Sir, Jiun Hann, Teoh, Hoay Tien, Lim, Min Suet, Goh, Eng Huat
Year of Publication 01.05.2018
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Year of Publication 01.05.2018
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THREE CAPACITOR STACK AND ASSOCIATED METHODS
LIM, Min Suet, TEOH, Hoay Tien, CHUA, Han Kung, GOH, Eng Huat, SIR, Jiun Hann
Year of Publication 05.04.2018
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Year of Publication 05.04.2018
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THREE CAPACITOR STACK AND ASSOCIATED METHODS
Sir Jiun Hann, Teoh Hoay Tien, Goh Eng Huat, Chua Han Kung, Lim Min Suet
Year of Publication 05.04.2018
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Year of Publication 05.04.2018
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SEMICONDUCTOR PACKAGE HAVING INTEGRATED STIFFENER REGION
LIM, Min Suet, LIFF, Shawna M, EID, Feras, GOH, Eng Huat, SIR, Jiun Hann
Year of Publication 22.03.2018
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Year of Publication 22.03.2018
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CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
YONG, Khang Choong, TAN, Fern Nee, LIM, Min Suet, GOH, Eng Huat, SIR, Jiun Hann
Year of Publication 21.12.2017
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Year of Publication 21.12.2017
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CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
Yong Khang Choong, Sir Jiun Hann, Goh Eng Huat, Tan Fern Nee, Lim Min Suet
Year of Publication 14.12.2017
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Year of Publication 14.12.2017
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PACKAGE-OBERSEITEN-EINGEBETTETE MULTI-DIE-VERBINDUNGS-BRÜCKE
Alur, Amruthavalli Pallavi, Sir, Jiun Hann, Mallik, Debendra, Khoo, Poh Boon, Goh, Eng Huat
Year of Publication 27.10.2022
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Year of Publication 27.10.2022
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