CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
KHOO, Poh Boon, WONG, Jia Yun, CHOONG, Chin Mian, GOH, Eng Huat, SIR, Jiun Hann, WONG, Jooi Wah
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
Patent
Multi-use package architecture
Yao, Jimin, Sir, Jiun Hann, Stamey, Richard C, Lim, Min Suet, Goh, Eng Huat, Lim, Chu Aun
Year of Publication 12.03.2024
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Year of Publication 12.03.2024
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SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
KHOO, Poh Boon, LEE, Chan Kim, GOH, Eng Huat, SIR, Jiun Hann, YUSOP, Nurul Khalidah, TEOH, Saw Beng
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
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EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
LIM, Chu Aun, LIM, Min Suet, KAMGAING, Telesphor, GOH, Eng Huat, SIR, Jiun Hann, NAGARAJAN, Kavitha, YOON, Chee Kheong
Year of Publication 07.12.2023
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Year of Publication 07.12.2023
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RFI free picture frame metal stiffener
Song, Wil Choon, Sir, Jiun Hann, Koh, Boon Ping, Lim, Min Suet, Goh, Eng Huat, Yong, Khang Choong
Year of Publication 23.05.2023
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Year of Publication 23.05.2023
Patent
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
Sir, Jiun Hann, Teoh, Hoay Tien, Lim, Min Suet, Goh, Eng Huat, Huang, Jimmy Huat Since
Year of Publication 05.05.2022
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Year of Publication 05.05.2022
Patent
Electronic package with passive component between substrates
Sir, Jiun Hann, Teoh, Hoay Tien, Lim, Min Suet, Goh, Eng Huat, Huang, Jimmy Huat Since
Year of Publication 01.03.2022
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Year of Publication 01.03.2022
Patent
Extended package air core inductor
Sir, Jiun Hann, Lim, Min Suet, Yap, Siew Fong, Goh, Eng Huat, Kuan, Chin Lee
Year of Publication 01.03.2022
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Year of Publication 01.03.2022
Patent
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPER SPREADER COMPONENT
LIM, Min Suet, KHOO, Poh Boon, KU, Jeff, CHUAH, Tin Poay, LIM, Yew San, LOO, Twan Sing, SIR, Jiun Hann
Year of Publication 07.12.2023
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Year of Publication 07.12.2023
Patent
Floating-bridge interconnects and methods of assembling same
Song, Wil Choon, Sir, Jiun Hann, Koh, Boon Ping, Lim, Min Suet, Goh, Eng Huat, Yong, Khang Choong
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
Patent
MULTI-USE PACKAGE ARCHITECTURE
Yao, Jimin, Sir, Jiun Hann, Stamey, Richard C, Lim, Min Suet, Goh, Eng Huat, Lim, Chu Aun
Year of Publication 09.06.2022
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Year of Publication 09.06.2022
Patent
Semiconductor package having integrated stiffener region
Eid, Feras, Sir, Jiun Hann, Liff, Shawna M, Lim, Min Suet, Goh, Eng Huat
Year of Publication 16.02.2021
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Year of Publication 16.02.2021
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