Search Results - "SIMON CHOOI" :: K.UTB vyhledávací portál

Method of application of copper solution in flip-chip, COB, and micrometal bonding

by XU YI, ZHOU MEI SHENG, ALIYU YAKUB, HO KWOK KEUNG PAUL, CHOOI SIMON, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 09.07.2002

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Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding

by XU YI, ZHOU MEI SHENG, ALIYU YAKUB, HO KWOK KEUNG PAUL, CHOOI SIMON, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 09.07.2002

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Method of application of copper solution in flip-chip, COB, and micrometal bonding

by Ho, Kwok Keung Paul, Chooi, Simon, Xu, Yi, Zhou, Mei Sheng, Aliyu, Yakub, Sudijono, John Leonard, Gupta, Subhash, Roy, Sudipto Ranendra
Year of Publication 09.07.2002

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Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique

by ROY SUDIPTO, ZHOU MEI SHENG, XU YI, ALIYU YAKUB, HO PAUL, SUDIJONO JOHN, CHOOI SIMON, GUPTA SUBHASH
Year of Publication 21.05.2002

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Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding

by XU YI, ZHOU MEI SHENG, ALIYU YAKUB, HO KWOK KEUNG PAUL, CHOOI SIMON, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 30.04.2002

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Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding

by Ho, Kwok Keung Paul, Chooi, Simon, Xu, Yi, Aliyu, Yakub, Zhou, Mei Sheng, Sudijono, John Leonard, Gupta, Subhash, Roy, Sudipto Ranendra
Year of Publication 30.04.2002

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Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes

by ZHOU MEI SHENG, XU YI, ALIYU YAKUB, CHOOI SIMON, HO PAUL KWOK KEUNG, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 25.04.2002

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APPLICATION OF VAPOR PHASE HFACAC-BASED COMPOUND FOR USE IN COPPER DECONTAMINATION AND CLEANING PROCESSES

by YAKUB ALIYU, MEI SHENG ZHOU, YI XU, SUBHASH GUPTA, PAUL HO KWOK KEUNG, JOHN LEONARD SUDIJONO, SUDIPTO RANENDRA ROY, SIMON CHOOI
Year of Publication 16.04.2002

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Process without post-etch cleaning-converting polymer and by-products into an inert layer

by ROY SUDIPTO, YI XU, ZHOU MEI SHENG, HO PAUL, ALIYU YAKUB, SUDIJONO JOHN, CHOOI SIMON, GUPTA SUBHASH
Year of Publication 02.04.2002

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Method of copper transport prevention by a sputtered gettering layer on backside of wafer

by YI XU, ZHOU MEI SHENG, ALIYU YAKUB, CHOOI SIMON, HO PAUL KWOK KEUNG, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 19.03.2002

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Method of copper transport prevention by a sputtered gettering layer on backside of wafer

by Gupta, Subhash, Chooi, Simon, Roy, Sudipto Ranendra, Ho, Paul Kwok Keung, Yi, Xu, Aliyu, Yakub, Zhou, Mei Sheng, Sudijono, John Leonard
Year of Publication 19.03.2002

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Method to remove copper contamination by using downstream oxygen and chelating agent plasma

by ZHOU MEI SHENG, XU YI, HO PAUL, ALIYU YAKUB, CHOOI SIMON, SUDIJONO JOHN, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 26.02.2002

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Method of copper transport prevention by a sputtered gettering layer on backside of wafer

by HO, PAUL KWOK KEUNG, SUDIJONO, JOHN LEONARD, ALIYU, YAKKUB, CHOOI, SIMON, YI, XU, ZHOU, MEI SHENG, GUPTA, SUBHASH, ROY, SUDIPTO RANENDRA
Year of Publication 23.01.2002

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Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads

by YI XU, ZHOU MEI SHENG, ALIYU YAKUB, HO PAUL, CHOOI SIMON, SUDIJONO JOHN, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 22.01.2002

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Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent

by XU YI, ALIYU YAKUB, HO PAUL, CHOOI SIMON, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH, ZHOU MEI-SHENG
Year of Publication 30.10.2001

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Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes

by ZHOU MEI SHENG, XU YI, ALIYU YAKUB, CHOOI SIMON, HO PAUL KWOK KEUNG, SUDIJONO JOHN LEONARD, ROY SUDIPTO RANENDRA, GUPTA SUBHASH
Year of Publication 17.07.2001

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A novel method to fabricate dish-free copper interconnects

by CHA, RANDALL, CHOOI, SIMON, LIM, VICTOR SENG-KEONG
Year of Publication 01.08.2003

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Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding

by ZHOU, MEI-SHENG, SUDIJONO, JOHN LEONARD, HO KWOK KEUNG, PAUL PAUL, YI XU, ALIYU, YAKUB, CHOOI, SIMON, SUBIPTO SUDIPTO RANENGRA ROY, GUPTA, SUBHASH
Year of Publication 16.10.2003

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processo para reduzir a concentração de ácidos carboxílicos solúveis em água em uma mistura hidrocarbonácea

by SIMON YEW-MENG CHOOI, LEE-HUAT CHIA
Year of Publication 29.12.2015

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