Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
Chooi, Simon, Aliyu, Yakub, Zhou, Mei Sheng, Sudijono, John, Gupta, Subhash, Roy, Sudipto, Ho, Paul, Xu, Yi
Year of Publication 22.11.2005
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Year of Publication 22.11.2005
Patent
Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding
Sudijono, John, Aliyu, Yakub, Zhou, Mei, Chooi, Simon, Gupta, Subhash, Roy, Sudipto, Ho, Paul, Xu, Yi
Year of Publication 16.10.2003
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Year of Publication 16.10.2003
Patent
Apparatus and methods to clean copper contamination on wafer edge
Roy, Sudipto, Gupta, Subhash, Chooi, Simon, Yi, Xu, Aliyu, Yakub, Zhou, Mei, Sudijono, John, Ho, Paul
Year of Publication 31.07.2003
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Year of Publication 31.07.2003
Patent
METHOD OF FORMING A HIGH PERFORMANCE AND LOW COST CMOS DEVICE
JIA ZHEN ZHENG, LIANG CHOO HSIA, CHEW HOE ANG, ENG HUA LIM, SOH YUN SIAH, SIMON CHOOI
Year of Publication 30.05.2005
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Year of Publication 30.05.2005
Patent
Method for selective oxide etching in pre-metal deposition
Zhou, Mei Sheng, Sih, Vincent, Chooi, Simon, Ismail, Zainab Bte, Ee, Ping Yu, Loong, Sang Yee
Year of Publication 11.03.2003
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Year of Publication 11.03.2003
Patent
Method of forming dual thickness gate dielectric structures via use of silicon nitride layers
Lin, Wenhe, Pey, Kin Leong, Zhou, Mei Sheng, Dong, Zhong, Chooi, Simon
Year of Publication 25.02.2003
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Year of Publication 25.02.2003
Patent