PREVENTING METHOD FOR BENDING OF AN INTEGRATED CIRCUIT PACKAGE
HWANG, INN-SUN, YEUM, DONG-SHIN, SIM, ILL-KWON, HAN, KYUNG-HEE, SONN, JOO-YOUNG, EUM, SE-JIN, HU, YOUNG-WOOK, CHON, CHOON-BAE, KIM, JINUN
Year of Publication 26.11.1997
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Year of Publication 26.11.1997
Patent
BALL GRID ARRAY PACKAGE WITH DEGATING AREA ON PCB BOARD AND THE MOLDING METHOD
HWANG, INN-SUN, RYU, JAE-JIN, YEUM, DONG-SHIN, SIM, ILL-KWON, HAN, KYUNG-HEE, SONN, JOO-YOUNG, EUM, SE-JIN, HU, YOUNG-WOOK, KIM, JINUN, CHON, CHOON-BAE
Year of Publication 07.07.1997
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Year of Publication 07.07.1997
Patent
IC PACKAGE
HWANG, INN-SUN, RYU, JAE-JIN, YEUM, DONG-SHIN, SIM, ILL-KWON, KIM, JIN-SUN, HAN, KYUNG-HEE, SONN, JOO-YOUNG, EUM, SE-JIN, HU, YOUNG-WOOK, CHON, CHOON-BAE
Year of Publication 03.06.1997
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Year of Publication 03.06.1997
Patent
SOLDER BALL SAFE METHOD OF PACKAGE
HU, YOUNG - WOOK, HAN, KYUNG - HEE, SONN, JOO - YOUNG, SIM, ILL - KWON, HWANG, INN - SUN, KIM, JIN - CHUN, CHON, CHOON - BAE, EUM, SE - JIN, RYU, JAE - JIN, YEUM, DONG - SHIN
Year of Publication 10.07.1996
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Year of Publication 10.07.1996
Patent