SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
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Year of Publication 03.09.2013
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Year of Publication 03.09.2013
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An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
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Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Semiconductor chip with redundant thru-silicon-vias
Su, Michael Z, Prejean, Seth, Refai-Ahmed, Gamal, Siegel, Joe, Black, Bryan
Year of Publication 17.09.2024
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Year of Publication 17.09.2024
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
REFAI-AHMED, GAMAL, SIEGEL, JOE, BLACK, BRYAN, PREJEAN, SETH, SU, MICHAEL Z
Year of Publication 02.02.2023
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Year of Publication 02.02.2023
Patent
Semiconductor chip with redundant thru-silicon-vias
Su, Michael Z, Prejean, Seth, Refai-Ahmed, Gamal, Siegel, Joe, Black, Bryan
Year of Publication 11.10.2022
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Year of Publication 11.10.2022
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
BLACK, Bryan, SIEGEL, Joe, REFAI-AHMED, Gamal, PREJEAN, Seth, SU, Michael, Z
Year of Publication 25.11.2020
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Year of Publication 25.11.2020
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Interposer with identification system
Su, Michael Z, Alfano, Michael, Din, Julius, Siegel, Joe, Black, Bryan
Year of Publication 14.05.2019
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Year of Publication 14.05.2019
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Su Michael Z, Black Bryan, Prejean Seth, Refai-Ahmed Gamal, Siegel Joe
Year of Publication 15.12.2016
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Year of Publication 15.12.2016
Patent
Semiconductor chip with redundant thru-silicon-vias
Su Michael Z, Black Bryan, Prejean Seth, Refai-Ahmed Gamal, Siegel Joe
Year of Publication 06.09.2016
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Year of Publication 06.09.2016
Patent
UNIVERSAL INTERCONNECT FOOTPRINT FOR BONDING SEMICONDUCTOR SUBSTRATES
MCLELLAN, NEIL, SIEGEL, JOE, SU, MICHAEL, BLACK, BRYAN, ALFANO, MICHAEL
Year of Publication 03.10.2013
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Year of Publication 03.10.2013
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DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
MCLELLAN, NEIL, SIEGEL, JOE, SU, MICHAEL, BLACK, BRYAN, ALFANO, MICHAEL
Year of Publication 03.10.2013
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Year of Publication 03.10.2013
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
REFAI-AHMED, GAMAL, SIEGEL, JOE, SU, MICHAEL, Z, BLACK, BRYAN, PREJEAN, SETH
Year of Publication 17.07.2013
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Year of Publication 17.07.2013
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
BLACK BRYAN, SU MICHAEL Z, PREJEAN SETH, SIEGEL JOE, REFAI-AHMED GAMAL
Year of Publication 15.03.2012
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Year of Publication 15.03.2012
Patent
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
REFAI-AHMED, GAMAL, SIEGEL, JOE, SU, MICHAEL, Z, BLACK, BRYAN, PREJEAN, SETH
Year of Publication 15.03.2012
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Year of Publication 15.03.2012
Patent