Search Results - "SHUTESH KRISHNAN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

by LIEW, How Kiat, KRISHNAN, Shutesh, CHEW, CH, WANG, Sw, TAN, Fui Fui
Year of Publication 21.02.2019

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Patent

Multi-chip module package

Multi-chip module package

by WANG SOONWEI, NURUL NADIAH MANAP, SHUTESH KRISHNAN
Year of Publication 26.11.2019

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Patent

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

by SHUTESH KRISHNAN, SOON WEI WANG
Year of Publication 27.04.2012

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Patent

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

by SHUTESH KRISHNAN, SOON WEI WANG
Year of Publication 27.04.2012

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Patent

Durch Silbersintern hergestellte Direct-Bonded-Copper-Substrate

Durch Silbersintern hergestellte Direct-Bonded-Copper-Substrate

by Carney, Francis J, Tolentino, Erik Nino Marcado, Krishnan, Shutesh
Year of Publication 22.07.2021

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Patent

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

by KRISHNAN SHUTESH, TOLENTINO ERIK NINO MARCADO, CARNEY FRANCIS J
Year of Publication 20.07.2021

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Patent

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

by KRISHNAN SHUTESH, WANG SOON WEI
Year of Publication 15.03.2012

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Patent

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

by KRISHNAN SHUTESH, WANG SOON WEI
Year of Publication 15.03.2012

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Patent

BONDING STRUCTURE AND METHOD

BONDING STRUCTURE AND METHOD

by KRISHNAN SHUTESH, WON YUN SUNG
Year of Publication 26.01.2012

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Patent

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

by JATINDER KUMAR, SHUTESH KRISHNAN
Year of Publication 30.01.2009

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Patent

Electronic device including a packaging substrate having a trench

Electronic device including a packaging substrate having a trench

by CHEW CHEE HIONG, KRISHNAN SHUTESH, KUMAR JATINDER
Year of Publication 27.08.2013

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Patent

Advanced materials for drop in solution to Pb in high temp solders: The next generation of zinc based solder alloy

Advanced materials for drop in solution to Pb in high temp solders: The next generation of zinc based solder alloy

by Jianxing Li, Bih Wen Fon, Krishnan, Shutesh, Knight, Brian
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)

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Conference Proceeding

Semiconductor package structure and method of manufacture

Semiconductor package structure and method of manufacture

by Krishnan, Shutesh, Kumar, Jatinder
Year of Publication 22.07.2008

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Patent

Semiconductor package structure and method of manufacture

Semiconductor package structure and method of manufacture

by KRISHNAN SHUTESH, KUMAR JATINDER
Year of Publication 22.07.2008

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Patent

Connector assembly and method of manufacture

Connector assembly and method of manufacture

by KRISHNAN, SHUTESH, WANG, SOON WEI
Year of Publication 01.01.2017

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Patent

Fabrication of one-dimensional CuO nanocrystals via pulsed wire explosion: structural, optical and electronic characterizations

Fabrication of one-dimensional CuO nanocrystals via pulsed wire explosion: structural, optical and electronic characterizations

by Krishnan, S., Haseeb, A. S. M. A., Rafie, M.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)

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Conference Proceeding

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH

by CHEW CHEE HIONG, KRISHNAN SHUTESH, KUMAR JATINDER
Year of Publication 06.12.2012

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Patent

Bonding structure and method

Bonding structure and method

by KRISHNAN, SHUTESH, WON, YUN SUNG
Year of Publication 21.09.2016

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Patent

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

by CHEW CHEE HIONG, KRISHNAN SHUTESH, KUMAR JATINDER
Year of Publication 18.09.2012

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Patent

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

by Krishnan, Shutesh, Chew, Chee Hiong, Kumar, Jatinder
Year of Publication 18.09.2012

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Patent

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