Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology
Xiaoxiong Gu, Silberman, Joel A., Young, Albert M., Jenkins, Keith A., Dang, Bing, Yong Liu, Xiaomin Duan, Gordin, Rachel, Shlafman, Shlomo, Goren, David
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
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Journal Article
DC Signature of Snap-through Bistability in Carbon Nanotube Mechanical Resonators
Rechnitz, Sharon, Tabachnik, Tal, Shlafman, Shlomo, Shlafman, Michael, Yaish, Yuval E.
Published in Nano letters (28.09.2022)
Published in Nano letters (28.09.2022)
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Journal Article
Variable Delay Transmission Lines in advanced CMOS SOI technology
Shlafman, Shlomo, Sheinman, Benny, Elad, Danny, Valdes-Garcia, Alberto, Sanduleanu, Mihai A. T.
Published in 2014 IEEE Radio Frequency Integrated Circuits Symposium (01.06.2014)
Published in 2014 IEEE Radio Frequency Integrated Circuits Symposium (01.06.2014)
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Conference Proceeding
A 60GHz, linear, direct down-conversion mixer with mm-Wave tunability in 32nm CMOS SOI
Sanduleanu, M. A. T., Valdes-Garcia, A., Liu, Y., Parker, B., Shlafman, Shlomo, Sheinman, Benny, Elad, Danny, Reynolds, Scott, Friedman, Daniel
Published in Proceedings of the IEEE 2013 Custom Integrated Circuits Conference (01.09.2013)
Published in Proceedings of the IEEE 2013 Custom Integrated Circuits Conference (01.09.2013)
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Conference Proceeding
DC Signature of snap-through bi-stability in carbon nanotube resonators
Rechnitz, Sharon, Tabachnik, Tal, Shlafman, Shlomo, Shlafman, Michael, Yaish, Yuval E
Published in arXiv.org (08.03.2022)
Published in arXiv.org (08.03.2022)
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Paper
Journal Article
Theoretical modelling of arch-shaped carbon nanotube resonators exhibiting Euler-Bernoulli snap-through bi-stability
Rechnitz, Sharon, Shlafman, Shlomo, Tabachnik, Tal, Shlafman, Michael, Yaish, Yuval E
Year of Publication 05.03.2022
Year of Publication 05.03.2022
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Journal Article
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications : THROUGH SILICON VIAS
GORDIN, Rachel, GOREN, David, SHLAFMAN, Shlomo, ELAD, Danny, SCHEUERMANN, Michael, YOUNG, Albert, FEI LIU, XIAOXIONG GU, TYBERG, Christy
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
Journal Article
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications
Gordin, R, Goren, D, Shlafman, S, Elad, D, Scheuermann, M, Young, A, Fei Liu, Xiaoxiong Gu, Tyberg, C
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
TSV multi-signal connection compact modeling
Mina, Essam, Shlafman, Shlomo, Gordin, Rachel, Sheinman, Benny, Elad, Danny
Published in 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013) (01.10.2013)
Published in 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013) (01.10.2013)
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Conference Proceeding