METHOD FOR SUPPLYING SOLDER
FURUNO, MASAHIKO, OHASHI, YUJI, SAITO, HIROSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, ANDOU, HARUHIKO, SHIRAI, MASARU
Year of Publication 31.08.2005
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Year of Publication 31.08.2005
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Heating device and reflow device
FURUNO, MASAHIKO, SAITO, HIROSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, SHIRAI, MASARU
Year of Publication 11.11.2010
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Year of Publication 11.11.2010
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METHOD FOR SUPPLYING SOLDER AND METHOD AND DEVICE FOR FORMING SOLDER BUMP USING IT
FURUNO MASAHIKO, SAITO KOJI, ONOZAKI JUNICHI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 04.08.2005
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Year of Publication 04.08.2005
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METHOD FOR SUPPLYING SOLDER
OHASHI YUJI, FURUNO MASAHIKO, ANDOU HARUHIKO, ONOZAKI JUNICHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO
Year of Publication 23.06.2005
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Year of Publication 23.06.2005
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Solder precoating method
FURUNO MASAHIKO, SAITO KOJI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SASAKI KOHEI
Year of Publication 07.04.2010
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Year of Publication 07.04.2010
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Method for precoating an electrode
HIRATUKA, ATSUSHI, FURUNO, MASAHIKO, SASAKI, KOHEI, SAITO, HIROSHI, SHIRAI, MASARU
Year of Publication 16.02.2010
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Year of Publication 16.02.2010
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METHOD FOR SUPPLYING SOLDER
JUNICHI ONOZAKI, ISAO SAKAMOTO, YUJI OHASHI, HIROSHI SAITO, MASAHIKO FURUNO, HARUHIKO ANDOU, MASARU SHIRAI
Year of Publication 30.06.2004
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Year of Publication 30.06.2004
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METHOD AND APPARATUS FOR MANUFACTURING PROTRUSION ELECTRODE
FURUNO MASAHIKO, SAITO KOJI, ONOZAKI JUNICHI, SHIRAI MASARU, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 21.11.2003
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Year of Publication 21.11.2003
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Solder bump forming method and apparatus
FURUNO MASAHIKO, HIRATSUKA ATSUSHI, ONOZAKI JUNICHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 28.03.2012
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Year of Publication 28.03.2012
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Method for supplying solder and solder projection forming method
OHASHI YUJI, FURUNO MASAHIKO, ANDOU HARUHIKO, ONOZAKI JUNICHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO
Year of Publication 02.06.2010
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Year of Publication 02.06.2010
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Heating device and reflow device
FURUNO, MASAHIKO, SAITO, HIROSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, SHIRAI, MASARU
Year of Publication 16.12.2006
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Year of Publication 16.12.2006
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Heater and reflow soldering apparatus
FURUNO MASAHIKO, ONOZAKI JUNICHI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 29.07.2009
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Year of Publication 29.07.2009
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Solder composition and method of bump formation therewith
FURUNO MASAHIKO, ONOZAKI JUNICHI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 17.06.2009
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Year of Publication 17.06.2009
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Solder bump forming method and apparatus
FURUNO MASAHIKO, ONOZAKI JUNICHI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 12.11.2008
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Year of Publication 12.11.2008
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Heater, reflow apparatus, and solder bump forming method and apparatus
FURUNO MASAHIKO, ONOZAKI JUNICHI, HIRATSUKA ATSUSHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
Year of Publication 28.03.2007
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Year of Publication 28.03.2007
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Heating device and reflow device, the method and device for forming solder bump
FURUNO, MASAHIKO, SAITO, HIROSHI, HIRATSUKA, ATSUSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, SHIRAI, MASARU, ANDOU, HARUHIKO
Year of Publication 01.02.2006
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Year of Publication 01.02.2006
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