Study of Submicron Panel-Level Packaging in Mass-Production
Shinoda, Ken-ichiro, Shelton, Douglas, Suda, Hiromi, Goto, Yoshio, Urushihara, Kosuke, Mori, Ken-Ichiro
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Study for realization of the next generation high density RDL packaging for 2.5D large silicon interposer
Mizutani, Masaki, Shelton, Douglas, Tokuyama, Yusuke, Shiozawa, Noriyuki, Murakami, Mizuma, Suda, Hiromi, Shinoda, Ken-Ichiro, Mori, Ken-Ichiro
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Study of Large Exposure Field Lithography for Advanced Chiplet Packaging
Suda, Hiromi, Shelton, Douglas, Takada, Hiroki, Goto, Yoshio, Urushihara, Kosuke, Shinoda, Ken-Ichiro
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding