De novo genome assembly of two tomato ancestors, Solanum pimpinellifolium and Solanum lycopersicum var. cerasiforme, by long-read sequencing
Takei, Hitomi, Shirasawa, Kenta, Kuwabara, Kosuke, Toyoda, Atsushi, Matsuzawa, Yuma, Iioka, Shinji, Ariizumi, Tohru
Published in DNA research (19.01.2021)
Published in DNA research (19.01.2021)
Get full text
Journal Article
A Novel Thermally Stable Polymer-Polyquinoline
Kamijima, Koichi, Kaji, Makoto, Iioka, Shinji, Honda, Yoshihiko, Lee, Virgil J.
Published in Journal of Photopolymer Science and Technology (1997)
Published in Journal of Photopolymer Science and Technology (1997)
Get full text
Journal Article
PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 22.01.2009
Get full text
Year of Publication 22.01.2009
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 11.11.2008
Get full text
Year of Publication 11.11.2008
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 11.11.2008
Get full text
Year of Publication 11.11.2008
Patent
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR
YOSHIYUKI TANABE, YOUICHI HOSOKAWA, SHINJI IIOKA, YOSHIHIRO NOMURA, HIROSHI KIRIHARA, SATORU YANAGISAWA
Year of Publication 31.12.2007
Get full text
Year of Publication 31.12.2007
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 25.09.2007
Get full text
Year of Publication 25.09.2007
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 25.09.2007
Get full text
Year of Publication 25.09.2007
Patent
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
YOSHIYUKI TANABE, YOUICHI HOSOKAWA, SHINJI IIOKA, YOSHIHIRO NOMURA, HIROSHI KIRIHARA, SATORU YANAGISAWA
Year of Publication 29.04.2006
Get full text
Year of Publication 29.04.2006
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 09.02.2006
Get full text
Year of Publication 09.02.2006
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 20.04.2005
Get full text
Year of Publication 20.04.2005
Patent
SEMICONDUCTOR DEVICE
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 08.12.1998
Get full text
Year of Publication 08.12.1998
Patent
MANUFACTURING OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 08.12.1998
Get full text
Year of Publication 08.12.1998
Patent
FILM WITH HEAT-RESISTANT ADHESIVE LAYER AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 30.06.1998
Get full text
Year of Publication 30.06.1998
Patent