by Jeng, Shin-Puu, Liu, Monsen
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)

by Wang, Chuei-Tang, Shang, Shu-An, Hsiao, Yu-Ming, Yan, Kathy, Jeng, Shin-Puu, Lee, Kam Heng, He, Jun
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

by Feng-Cheng Hsu, Lin, Jackson, Shuo-Mao Chen, Po-Yao Lin, Fang, Jerry, Jin-Hua Wang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Shyue-Ter Leu, Shin-Puu Jeng
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Banijamali, Bahareh, Chien-Chia Chiu, Cheng-Chieh Hsieh, Tsung-Shu Lin, Hu, Clark, Shang-Yun Hou, Ramalingam, Suresh, Shin-Puu Jeng, Madden, Liam, Yu, Doug C. H.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)

by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Liu, C. C., Shuo-Mao Chen, Feng-Wei Kuo, Huan-Neng Chen, En-Hsiang Yeh, Cheng-Chieh Hsieh, Li-Hsien Huang, Ming-Yen Chiu, Yeh, J., Tsung-Shu Lin, Tzu-Jin Yeh, Shang-Yun Hou, Jui-Pin Hung, Jing-Cheng Lin, Chewn-Pu Jou, Chuei-Tang Wang, Shin-Puu Jeng, Yu, D. C. H.
Published in 2012 International Electron Devices Meeting (01.12.2012)

by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)

by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Shyue-Ter Leu
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)

by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)

by Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Shyue-Ter Leu, Kuo-Chuan Liu
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)

by Lin, M.L., Liu, M.S., Chen, H.W., Chen, S.M., Yew, M.C., Chen, C.S., Jeng, Shin-Puu
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Lin, Yi-Hang, Yew, M.C., Chen, S.M., Liu, M.S., Kavle, Pravin, Lai, T.M., Yu, C.T., Hsu, F.C., Chen, C.S., Fang, T.J., Hsu, C.K., Lee, K.C., Lin, C.H., Lin, P.Y., Jeng, Shin-Puu
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)

by Lee, Chien-Hsun, Hu, YH, Chen, SM, Lai, CL, Liu, M, Chen, HY, Lin, J, Yew, MC, Hsu, CK, Chiu, MY, Chen, CH, Chou, MW, Chen, WC, Chang, J, Hsieh, C.C., Chen, CS, Chen, HW, Wang, CT, Yan, Kathy, Jeng, Shin-Puu, He, Jun
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

by Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Jeng, Shin-Puu, Henrich, Victor E.
Published in Solid state communications (01.06.1992)

by Jeng, Shin-Puu, Holloway, Paul H., Batich, Chris D.
Published in Surface science (01.03.1990)

by Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Chen, C. H., Lee, Y. C., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Hsiu-Ping Wei, Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Yu, D.C.H.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)