Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength
Park, Jongwoo, Cha, Hyun-Joon, Kim, Back-Sung, Jo, Yong-Bum, Park, June-Kyun, Kim, Sam-Young, Shin, Sang-Cheol, Shin, Man-Young, Ouh, Kyung-Il, Jeon, Hyungoo
Published in IEEE transactions on components and packaging technologies (01.12.2007)
Published in IEEE transactions on components and packaging technologies (01.12.2007)
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