Thermal Resistance Measurement of LED Package with Multichips
Lan Kim, Lan Kim, Moo Whan Shin, Moo Whan Shin
Published in IEEE transactions on components and packaging technologies (01.12.2007)
Published in IEEE transactions on components and packaging technologies (01.12.2007)
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Journal Article
Metal–organic framework coating layer with inherent self-reactivity toward lithium ions to enhance both structural stability and electrochemical performance of LiNi0.9Co0.085Mn0.015O2 cathodes
Shin, Seoyoon, Yoon, Yeowon, Park, Sooyeol, Whan Shin, Moo
Published in Applied surface science (15.01.2024)
Published in Applied surface science (15.01.2024)
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Journal Article
Metal–organic frameworks-derived porous carbon/Co3O4 composites for rechargeable lithium–oxygen batteries
Song, Myeong Jun, Kim, Il To, Kim, Young Bok, Kim, Jiwon, Shin, Moo Whan
Published in Electrochimica acta (10.03.2017)
Published in Electrochimica acta (10.03.2017)
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Journal Article
Self-standing, binder-free electrospun Co3O4/carbon nanofiber composites for non-aqueous Li-air batteries
Song, Myeong Jun, Kim, Il To, Kim, Young Bok, Shin, Moo Whan
Published in Electrochimica acta (10.11.2015)
Published in Electrochimica acta (10.11.2015)
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Journal Article
Co- and defect-rich carbon nanofiber films as a highly efficient electrocatalyst for oxygen reduction
Kim, Il To, Song, Myeong Jun, Shin, Seoyoon, Shin, Moo Whan
Published in Applied surface science (30.03.2018)
Published in Applied surface science (30.03.2018)
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Journal Article
Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes
Hu, Jianzheng, Yang, Lianqiao, Shin, Moo Whan
Published in Journal of physics. D, Applied physics (07.02.2008)
Published in Journal of physics. D, Applied physics (07.02.2008)
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Journal Article
Thermal analysis of LED array system with heat pipe
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Journal Article
Conference Proceeding
Thermal Investigation of GaN-Based Laser Diode Package
Wong Joon Hwang, Tae Hee Lee, Jong Hwa Choi, Hyung Kun Kim, Ok Hyun Nam, Park, Y.J., Moo Whan Shin
Published in IEEE transactions on components and packaging technologies (01.12.2007)
Published in IEEE transactions on components and packaging technologies (01.12.2007)
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Journal Article