Electromigration behavior of advanced metallization on the structural effects for memory devices
Jang, Kyung-Tae, Park, Yong-Jin, Jeong, Min-Woo, Lim, Seung-Min, Yeon, Han-Wool, Cho, Ju-Young, Jin, Min-Gi, Shin, Jin-Sub, Woo, Byoung-Wook, Bae, Jang-Yong, Hwang, Yu-Chul, Joo, Young-Chang
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Journal Article
Electromigration-limited reliability of advanced metallization for memory devices
Kyung-Tae Jang, Yong-Jin Park, Min-Woo Jeong, Seung-Min Lim, Han-Wool Ycon, Ju-Young Cho, Jin-Sub Shin, Byoung-Wook Woo, Jang-Yong Bae, Yu-Chul Hwang, Young-Chang Joo
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding