Semiconductor device having solder bumps reliably reflow solderable
SOGA TASAO, MIURA KAZUMA, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, SERIZAWA KOJI
Year of Publication 13.02.2003
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Year of Publication 13.02.2003
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Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE
SOGA, TASAO, INABA, YOSHIHARU, NISHIMURA, ASAO, OKUDAIRA, HIROAKI, NAKATSUKA, TETSUYA, SHIMOKAWA, HANAE, ISHIDA, TOSHIHARU
Year of Publication 18.10.2006
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Year of Publication 18.10.2006
Patent
PB-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE
NISHIMURA, ASAO, SOGA, TASAO, INABA, YOSHIHARU, OKUDAIRA, HIROAKI, NAKATSUKA, TETSUYA, SHIMOKAWA, HANAE, ISHIDA, TOSHIHARU
Year of Publication 01.08.2006
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Year of Publication 01.08.2006
Patent
Semiconductor device
SOGA, TASAO, INABA, YOSHIHARU, NISHIMURA, ASAO, OKUDAIRA, HIROAKI, NAKATSUKA, TETSUYA, SHIMOKAWA, HANAE, ISHIDA, TOSHIHARU
Year of Publication 19.07.2006
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Year of Publication 19.07.2006
Patent
Electronic device
Soga, Tasao, Shimokawa, Hanae, Nakatsuka, Tetsuya, Miura, Kazuma, Negishi, Mikio, Nakajima, Hirokazu, Endoh, Tsuneo
Year of Publication 11.07.2006
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Year of Publication 11.07.2006
Patent
Electronic device
SOGA TASAO, NAKAJIMA HIROKAZU, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, MIURA KAZUMA, ENDOH TSUNEO, NEGISHI MIKIO
Year of Publication 11.07.2006
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Year of Publication 11.07.2006
Patent
Pb-free solder-connected structure and electronic device
SOGA TASAO, INABA YOSHIHARU, NISHIMURA ASAO, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, ISHIDA TOSHIHARU, OKUDAIRA HIROAKI
Year of Publication 01.06.2006
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Year of Publication 01.06.2006
Patent
Method of producing an electronic device having a PB free solder connection
Shimokawa, Hanae, Soga, Tasao, Okudaira, Hiroaki, Ishida, Toshiharu, Nakatsuka, Tetsuya, Inaba, Yoshiharu, Nishimura, Asao
Year of Publication 21.03.2006
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Year of Publication 21.03.2006
Patent
Method of producing an electronic device having a PB free solder connection
SOGA TASAO, INABA YOSHIHARU, NISHIMURA ASAO, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, ISHIDA TOSHIHARU, OKUDAIRA HIROAKI
Year of Publication 21.03.2006
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Year of Publication 21.03.2006
Patent
Semiconductor module and circuit substrate
SOGA TASAO, MIURA KAZUMA, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, SERIZAWA KOJI
Year of Publication 13.12.2001
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Year of Publication 13.12.2001
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Semiconductor module and circuit substrate
Miura, Kazuma, Shimokawa, Hanae, Serizawa, Koji, Soga, Tasao, Nakatsuka, Tetsuya
Year of Publication 13.12.2001
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Year of Publication 13.12.2001
Patent
Pb-free solder-connected structure and electronic device
SOGA TASAO, INABA YOSHIHARU, NISHIMURA ASAO, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, ISHIDA TOSHIHARU, OKUDAIRA HIROAKI
Year of Publication 01.11.2005
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Year of Publication 01.11.2005
Patent
Pb-free solder-connected structure and electronic device
Shimokawa, Hanae, Soga, Tasao, Okudaira, Hiroaki, Ishida, Toshiharu, Nakatsuka, Tetsuya, Inaba, Yoshiharu, Nishimura, Asao
Year of Publication 01.11.2005
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Year of Publication 01.11.2005
Patent
Method and equipment for manufacturing electronic circuit board
SOGA, TASAO, SERIZAWA, KOJI, NAKATSUKA, TETSUYA, SHIMOKAWA, HANAE, ISHIDA, TOSHIHARU
Year of Publication 01.09.2001
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Year of Publication 01.09.2001
Patent
Semiconductor device
SOGA TASAO, INABA YOSHIHARU, NISHIMURA ASAO, SHIMOKAWA HANAE, NAKATSUKA TETSUYA, ISHIDA TOSHIHARU, OKUDAIRA HIROAKI
Year of Publication 16.06.2004
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Year of Publication 16.06.2004
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Halbleiterleistungsmodul
SOGA, TASAO, KAWASE, DAISUKE, SUZUKI, KAZUHIRO, SHIMOKAWA, HANAE, SAITO, KATSUAKI, MORISAKI, EIICHI
Year of Publication 21.06.2012
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Year of Publication 21.06.2012
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Halbleiterleistungsmodul
SOGA, TASAO, KAWASE, DAISUKE, SUZUKI, KAZUHIRO, SHIMOKAWA, HANAE, SAITO, KATSUAKI, MORISAKI, EIICHI
Year of Publication 22.03.2012
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Year of Publication 22.03.2012
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Pb-free solder-connected electronic device
SOGA, TASAO, INABA, YOSHIHARU, NISHIMURA, ASAO, OKUDAIRA, HIROAKI, NAKATSUKA, TETSUYA, SHIMOKAWA, HANAE, ISHIDA, TOSHIHARU
Year of Publication 12.02.2003
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Year of Publication 12.02.2003
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