New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications
Yamaguchi, Eiji, Tsuji, Mutsuo, Shimoishizaka, Nozomi, Nakano, Takahiro, Hirata, Katsunori
Published in ECS transactions (08.03.2013)
Published in ECS transactions (08.03.2013)
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Journal Article
High aspect / narrow pitch substrate wiring and bump formation using imprinting technology for low temperature flip chip bonding
Komatsu, Hiroshi, Sakai, Daisuke, Shimoishizaka, Nozomi, Yamada, Toshihiro
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
GAS SENSOR MODULE AND GAS SENSOR SYSTEM
SHIMOISHIZAKA NOZOMI, KURIHARA MAI, MACHIDA HIDEKAZU, KAWAGUCHI YASUAKI
Year of Publication 20.09.2023
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Year of Publication 20.09.2023
Patent
공구, 작업 관리장치, 작업 관리방법 및 작업 관리 시스템
SHIMOISHIZAKA NOZOMI, SHINOHARA TSUTOMU, HORIKAWA KAZUTOSHI, YAMATO YOSHIAKI, OCHIISHI MASAHIKO, HARADA AKIHIRO, KARUBE HIROKI, MACHIDA HIDEKAZU, NEBASHI TORU, KOYOMOGI MUTSUNORI
Year of Publication 20.07.2020
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Year of Publication 20.07.2020
Patent
TOOL, WORK MANAGEMENT DEVICE, WORK MANAGEMENT METHOD, AND WORK MANAGEMENT SYSTEM
HARADA Akihiro, KOYOMOGI Mutsunori, KARUBE Hiroki, NEBASHI Toru, OCHIISHI Masahiko, SHIMOISHIZAKA Nozomi, SHINOHARA Tsutomu, MACHIDA Hidekazu, YAMATO Yoshiaki, HORIKAWA Kazutoshi
Year of Publication 13.06.2019
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Year of Publication 13.06.2019
Patent
Tool, work management device, work management method, and work management system
HARADA Akihiro, KOYOMOGI Mutsunori, KARUBE Hiroki, NEBASHI Toru, OCHIISHI Masahiko, SHIMOISHIZAKA Nozomi, SHINOHARA Tsutomu, MACHIDA Hidekazu, YAMATO Yoshiaki, HORIKAWA Kazutoshi
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent