METHOD FOR FORMING THREE-DIMENSIONAL WIRING, CIRCUIT DEVICE HAVING THREE-DIMENSIONAL WIRING, AND COMPOSITION FOR FORMING METAL FILM FOR THREE-DIMENSIONAL WIRING
KOBAYASHI ATSUSHI, ARITOME ISAO, MATSUMOTO TAICHI, OOKITA KENZOU, SHIMODA SUGIROU, WATANABE KAZUTO, KURIYAMA KEISUKE
Year of Publication 08.03.2016
Get full text
Year of Publication 08.03.2016
Patent
METAL FILM FORMING METHOD AND CONDUCTIVE INK USED IN SAID METHOD
ARITOME ISAO, SHIMODA SUGIROU, OOKITA KENZOU, WATANABE KAZUTO, TANAKA KENROU
Year of Publication 25.02.2016
Get full text
Year of Publication 25.02.2016
Patent
Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
Aritome Isao, Watanabe Kazuto, Matsumoto Taichi, Ookita Kenzou, Kobayashi Atsushi, Shimoda Sugirou, Kuriyama Keisuke
Year of Publication 10.01.2017
Get full text
Year of Publication 10.01.2017
Patent
METHOD FOR FORMING THREE-DIMENSIONAL INTERCONNECTION, CIRCUIT ARRANGEMENT COMPRISING THREE-DIMENSIONAL INTERCONNECTION, AND METAL FILM-FORMING COMPOSITION FOR THREE-DIMENSIONAL INTERCONNECTION
KOBAYASHI ATSUSHI, ARITOME ISAO, MATSUMOTO TAICHI, OOKITA KENZOU, SHIMODA SUGIROU, WATANABE KAZUTO, KURIYAMA KEISUKE
Year of Publication 03.03.2016
Get full text
Year of Publication 03.03.2016
Patent
Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
KURIYAMA, KEISUKE, KOBAYASHI, ATSUSHI, OOKITA, KENZOU, SHIMODA, SUGIROU, WATANABE, KAZUTO, MATSUMOTO, TAICHI, ARITOME, ISAO
Year of Publication 01.03.2016
Get full text
Year of Publication 01.03.2016
Patent
Copper film forming method, copper film, circuit board and copper film forming composition solution
KUWADA, HIROAKI, MOCHIZUKI, DAIGOU, SHIMODA, SUGIROU, TANAKA, KENROU, ARITOME, ISAO
Year of Publication 16.07.2013
Get full text
Year of Publication 16.07.2013
Patent