Search Results - "SHIMODA, SUGIROU" :: K.UTB vyhledávací portál

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LAMINATE, METHOD FOR PRODUCING SAME AND ELECTRONIC COMPONENT

by SHIMODA Sugirou, TATARA Ryouji, HIRAI Tsuyoshi, YAMASHITA Yuutoku
Year of Publication 20.09.2018

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COMPOSITION FOR FORMING CONDUCTIVE FILM, CONDUCTIVE FILM, METHOD OF MANUFACTURING PLATING FILM, PLATING FILM AND ELECTRONIC DEVICE

by SATOU KEISUKE, SHIMODA SUGIROU, OOKITA KENZOU, WATANABE KAZUTO
Year of Publication 22.03.2016

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METHOD FOR FORMING METAL FILM, CONDUCTIVE INK USED IN THE METHOD, MULTILAYER WIRING BOARD, SEMICONDUCTOR SUBSTRATE, AND CAPACITOR CELL

by ARITOME ISAO, SHIMODA SUGIROU, OOKITA KENZOU, WATANABE KAZUTO, TANAKA KENROU
Year of Publication 05.09.2014

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METHOD FOR FORMING THREE-DIMENSIONAL WIRING, CIRCUIT DEVICE HAVING THREE-DIMENSIONAL WIRING, AND COMPOSITION FOR FORMING METAL FILM FOR THREE-DIMENSIONAL WIRING

by KOBAYASHI ATSUSHI, ARITOME ISAO, MATSUMOTO TAICHI, OOKITA KENZOU, SHIMODA SUGIROU, WATANABE KAZUTO, KURIYAMA KEISUKE
Year of Publication 08.03.2016

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METHOD FOR FORMING COPPER FILM, COPPER FILM, CIRCUIT SUBSTRATE, AND COPPER-FILM-FORMING COMPOSITION SOLUTION

by KUWADA, HIROAKI, MOCHIZUKI, DAIGOU, SHIMODA, SUGIROU, TANAKA, KENROU, ARITOME, ISAO
Year of Publication 23.05.2013

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Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device

by Watanabe Kazuto, Ookita Kenzou, Shimoda Sugirou, Satou Keisuke
Year of Publication 07.11.2017

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COMPOSITION FOR FORMING A CONDUCTIVE FILM, A CONDUCTIVE FILM, A METHOD FOR PRODUCING A PLATING FILM, A PLATING FILM, AND AN ELECTRONIC DEVICE

by SATOU KEISUKE, SHIMODA SUGIROU, OOKITA KENZOU, WATANABE KAZUTO
Year of Publication 17.03.2016

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METAL FILM FORMING METHOD AND CONDUCTIVE INK USED IN SAID METHOD

by ARITOME ISAO, SHIMODA SUGIROU, OOKITA KENZOU, WATANABE KAZUTO, TANAKA KENROU
Year of Publication 25.02.2016

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Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection

by Aritome Isao, Watanabe Kazuto, Matsumoto Taichi, Ookita Kenzou, Kobayashi Atsushi, Shimoda Sugirou, Kuriyama Keisuke
Year of Publication 10.01.2017

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METHOD FOR FORMING THREE-DIMENSIONAL INTERCONNECTION, CIRCUIT ARRANGEMENT COMPRISING THREE-DIMENSIONAL INTERCONNECTION, AND METAL FILM-FORMING COMPOSITION FOR THREE-DIMENSIONAL INTERCONNECTION

by KOBAYASHI ATSUSHI, ARITOME ISAO, MATSUMOTO TAICHI, OOKITA KENZOU, SHIMODA SUGIROU, WATANABE KAZUTO, KURIYAMA KEISUKE
Year of Publication 03.03.2016

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Forming method of metal film, conductive ink, multilayer wiring substrate, semiconductor substrate, and capacitor cell of dynamic random access memory

by SHIMODA, SUGIROU, OOKITA, KENZOU, WATANABE, KAZUTO, TANAKA, KENROU, ARITOME, ISAO
Year of Publication 01.10.2017

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Forming method of metal film, conductive ink, multilayer wiring substrate, semiconductor substrate, and capacitor cell of dynamic random access memory

by SHIMODA, SUGIROU, OOKITA, KENZOU, WATANABE, KAZUTO, TANAKA, KENROU, ARITOME, ISAO
Year of Publication 16.10.2014

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Method for forming metal film, conductive ink, multilayer wiring board, semiconductor substrate, and capacitor cell

by OOKITA, KENZOU, SHIMODA, SUGIROU, WATANABE, KAZUTO, TANAKA, KENROU, ARITOME, ISAO
Year of Publication 03.09.2014

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Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection

by KURIYAMA, KEISUKE, KOBAYASHI, ATSUSHI, OOKITA, KENZOU, SHIMODA, SUGIROU, WATANABE, KAZUTO, MATSUMOTO, TAICHI, ARITOME, ISAO
Year of Publication 01.03.2016

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