METHOD FOR PRODUCING SUBSTRATE LAMINATE AND SEMICONDUCTOR DEVICE
KAYABA, Yasuhisa, OKADA, Wataru, SHIKAMA, Takuo, FURUSHO, Rikia, TAMURA Kahori, NAKAMURA, Yuzo, KOHMURA, Kazuo
Year of Publication 08.02.2024
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Year of Publication 08.02.2024
Patent
Bump-Less Interconnect with Room Temperature Pre-Bondable Adhesive and Solder for High Throughput Chip Stacking
Okada, Wataru, Nakamura, Yuzo, Kayaba, Yasuhisa, Shikama, Takuo, Hisamune, Yutaka, Tamura, Kahori, Inada, Satoshi, Furusho, Rikia
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer
Kayaba, Yasuhisa, Shikama, Takuo, Okada, Wataru, Tamura, Kahori, Nakamura, Yuzo, Hisamune, Yutaka, Furusho, Rikia
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding
Nakamura, Yuzo, Tamura, Kahori, Kayaba, Yasuhisa, Okada, Wataru, Shikama, Takuo, Inada, Satoshi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature pre-Bonding
Kayaba, Yasuhisa, Nakamura, Yuzo, Okada, Wataru, Shikama, Takuo, Tamura, Kahori, Inada, Satoshi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding