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"SHIGA GOSHI"
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TWI795504B
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
11.03.2023
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102
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TWI795503B
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
11.03.2023
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103
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TWI789476B
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
11.01.2023
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104
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MARKING METHOD OF SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
by
TAKAMOTO HISAHIDE
,
SHIGA GOSHI
Year of Publication
19.12.2013
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105
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TWI772520B
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
01.08.2022
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106
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR
by
TAKAMOTO HISAHIDE
,
SHIGA GOSHI
Year of Publication
10.11.2011
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107
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
Year of Publication
10.11.2011
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108
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR
by
TAKAMOTO HISAHIDE
,
SHIGA GOSHI
Year of Publication
10.11.2011
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109
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
Year of Publication
10.11.2011
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110
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
Year of Publication
10.11.2011
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111
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE
by
TAKAMOTO HISAHIDE
,
SHIGA GOSHI
Year of Publication
10.11.2011
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112
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REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
Year of Publication
10.11.2011
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113
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Thermal curable adhesive film, sheet material for semiconductor process and semiconductor package manufacturing method wherein the thermal curable adhesive film is viscoelastic
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
01.12.2020
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114
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Semiconductor back contact film and dicing tape integrated semiconductor back contact film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back contact film is attached
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
01.11.2020
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115
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SEMICONDUCTOR BACK SURFACE CONTACT FILM AND DICING TAPE-INTEGRATED SEMICONDUCTOR BACK SURFACE CONTACT FILM
by
SATO SATOSHI
,
SHIGA GOSHI
,
TAKAMOTO NAOHIDE
Year of Publication
11.09.2020
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116
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Semiconductor process sheet and method for manufacturing semiconductor package
by
SATO SATOSHI
,
SHIGA GOSHI
,
TAKAMOTO NAOHIDE
Year of Publication
26.06.2020
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117
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Back surface adhesion film and dicing tape-combined back surface adhesion film
by
SATO, SATOSHI
,
TAKAMOTO, NAOHIDE
,
SHIGA
,
GOSHI
Year of Publication
01.04.2020
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118
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DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
by
TAKAMOTO HISAHIDE
,
SHIGA GOSHI
,
MATSUMURA TAKESHI
Year of Publication
07.08.2014
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ADHESIVE SHEET, DICING TAPE INTEGRATED ADHESIVE SHEET, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
,
MIZUNO KOJI
Year of Publication
24.07.2014
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DICING TAPE INTEGRATED ADHESIVE SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING DICING TAPE INTEGRATED ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE
by
SHIGA GOSHI
,
TAKAMOTO HISAHIDE
,
MIZUNO KOJI
Year of Publication
24.07.2014
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