Search Results - "SHI SONGHUA" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

by Songhua Shi, Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.10.1999)

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Journal Article

Development of the wafer level compressive-flow underfill process and its involved materials

Development of the wafer level compressive-flow underfill process and its involved materials

by Songhua Shi, Yamashita, T., Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.10.1999)

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Journal Article

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

by Songhua Shi, Daoqiang Lu, Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.10.1999)

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Journal Article

High performance no-flow underfills for low-cost flip-chip applications: material characterization

High performance no-flow underfills for low-cost flip-chip applications: material characterization

by Wong, C.P., Shi, S.H., Jefferson, G.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1998)

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Journal Article

Research progress on the radar cross section of the UAV in the complex electromagnetic environments

Research progress on the radar cross section of the UAV in the complex electromagnetic environments

by Xiang Min, Niu Liqiang, Wu Peiyu, Xie Yongjun, Shi Songhua, Yan Jie
Published in Diànzǐ jìshù yīngyòng (01.06.2019)

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Journal Article

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

by HENSCHEL, Mark E, SHI, Songhua
Year of Publication 19.07.2023

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Patent

Wiring terminal for electric power engineering

Wiring terminal for electric power engineering

by SHI SONGHUA
Year of Publication 21.10.2022

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Patent

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

by HENSCHEL, Mark E, SHI, Songhua
Year of Publication 17.03.2022

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Patent

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

by Shi, Songhua, Henschel, Mark E
Year of Publication 10.03.2022

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Patent

METHOD OF TARGET FEATURE EXTRACTION AND MULTI-TARGET TRACKING BASED ON 4D MILLIMETER WAVE RADAR

METHOD OF TARGET FEATURE EXTRACTION AND MULTI-TARGET TRACKING BASED ON 4D MILLIMETER WAVE RADAR

by Shi, Songhua, Lu, Xinfei, Zhang, Jianjun, Xue, Dan, Pan, Song
Year of Publication 29.08.2024

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Patent

Method of sparse array oriented approach for DOA estimation of grating lobe target filtering

Method of sparse array oriented approach for DOA estimation of grating lobe target filtering

by Zhao, Yue, Shi, Songhua, Xue, Dan, Zhou, Mingyu
Year of Publication 28.05.2024

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Patent

Xerographic printing on textiles

Xerographic printing on textiles

by Carr, W.W., Sarma, D.S., Lejun Wang, Songhua Shi, Cook, F.L., Pfromm, P.H.
Published in IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting (1996)

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Conference Proceeding

Safety protection device for electric power engineering operation

Safety protection device for electric power engineering operation

by SHI SONGHUA
Year of Publication 26.06.2020

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Patent

Automatic take-up device for electric power engineering

Automatic take-up device for electric power engineering

by SHI SONGHUA
Year of Publication 26.06.2020

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Patent

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

by KIM, Chunho, HENSCHEL, Mark E, SHI, Songhua
Year of Publication 22.09.2021

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Patent

Fundamentals of Advanced Materials and Processes in Organic Substrate Technology

Fundamentals of Advanced Materials and Processes in Organic Substrate Technology

by Shi, Songhua, Tortorici, Peter
Published in 3D Microelectronic Packaging (01.01.2017)

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Book Chapter

FEEDTHROUGH HEADER ASSEMBLY AND DEVICE INCLUDING SAME

FEEDTHROUGH HEADER ASSEMBLY AND DEVICE INCLUDING SAME

by RIES, Andrew J, NYGREN, Lea Ann, SUTANTO, Jemmy, HENSCHEL, Mark E, SHI, Songhua
Year of Publication 06.12.2023

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Patent

A predictor feedback control method for time-delay systems using Guass-Legendre integration

A predictor feedback control method for time-delay systems using Guass-Legendre integration

by Li, Chaolin, Wu, Xiongjun, Shi, Songhua, Zhou, Jialing
Published in 2017 11th Asian Control Conference (ASCC) (01.12.2017)

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Conference Proceeding

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

by KIM, Chunho, HENSCHEL, Mark E, SHI, Songhua
Year of Publication 22.05.2020

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Patent

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

by KIM, Chunho, HENSCHEL, Mark E, SHI, Songhua
Year of Publication 14.05.2020

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Patent

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