Microvia filling by copper electroplating using diazine black as a leveler
Dow, Wei-Ping, Li, Chih-Chan, Su, Yong-Chih, Shen, Shao-Ping, Huang, Chen-Chia, Lee, Cliff, Hsu, Bob, Hsu, Shar
Published in Electrochimica acta (01.10.2009)
Published in Electrochimica acta (01.10.2009)
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Journal Article
Intracranial electrodes monitoring improves seizure control and complication outcomes for patients with temporal lobe epilepsy - A retrospective cohort study
Lyu, Yan-En, Xu, Xiao-Fei, Dai, Shuang, Dong, Xiao-Bo, Shen, Shao-Ping, Wang, Yao, Liu, Chong
Published in International journal of surgery (London, England) (01.03.2018)
Published in International journal of surgery (London, England) (01.03.2018)
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Journal Article
Resection of bilateral occipital lobe lesions during a single operation as a treatment for bilateral occipital lobe epilepsy
Lyu, Yan-En, Xu, Xiao-Fei, Dai, Shuang, Feng, Min, Shen, Shao-Ping, Zhang, Guo-Zhen, Ju, Hong-Yan, Wang, Yao, Dong, Xiao-Bo, Xu, Bin
Published in World journal of clinical cases (06.12.2021)
Published in World journal of clinical cases (06.12.2021)
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Journal Article
The application of dendritic cells vaccination in malignant glioma
Hong⁃yu LIU, Shao⁃ping SHEN, Lin YANG, Xin⁃guang YU, Ling CHEN
Published in Zhongguo xian dai shen jing ji bing za zhi (01.02.2020)
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Published in Zhongguo xian dai shen jing ji bing za zhi (01.02.2020)
Journal Article
Novel Cu plating formula for filling through silicon vias
Shao-Ping Shen, Wei-Ping Dow, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, Fu-Chiang Hsu
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
The application of dendritic cells vaccination in malignant glioma
Hong⁃yu LIU, Shao⁃ping SHEN, YANG, Lin, Xin⁃guang YU, CHEN, Ling
Published in Zhongguo xian dai shen jing ji bing za zhi (01.01.2020)
Published in Zhongguo xian dai shen jing ji bing za zhi (01.01.2020)
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Journal Article
The Effect of Polymeric Additives on TSV Filling by Copper Electroplating
Tsai, Hsiu-Ping, Shen, Shao-Ping, Dow, Wei-Ping
Published in Meeting abstracts (Electrochemical Society) (08.07.2010)
Published in Meeting abstracts (Electrochemical Society) (08.07.2010)
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Journal Article
Electroless Deposition of Barrier and Seed Layers for TSV Metallization
Chou, Chia-Pei, Dow, Wei-Ping, Shen, Shao-Ping, Chang, Yiu-Hsiang, Lin, Jing-Yuan, Hsu, Fu-Chiang
Published in Meeting abstracts (Electrochemical Society) (01.03.2011)
Published in Meeting abstracts (Electrochemical Society) (01.03.2011)
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Journal Article
Wet Processes for Filling through Silicon Vias and Butterfly Technology for Filling through Silicon Holes
Shen, Shao-Ping, Dow, Wei-Ping, Lu, Chun-Wei, Chang, Yiu-Hsiang, Chou, Chia-Pei, Kubo, Motonobu, Kamitamari, Tohru, Cheng, Eric, Lin, Jing-Yuan, Hsu, Fu-Chiang
Published in Meeting abstracts (Electrochemical Society) (01.03.2011)
Published in Meeting abstracts (Electrochemical Society) (01.03.2011)
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Journal Article
Electronic package and method for fabricating the same
SUN, SUNG-HUAN, FU, KAI-LING, CHEN, CHENG-YU, CHANG, MING-YING, SHEN, SHAO-PING
Year of Publication 01.07.2019
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Year of Publication 01.07.2019
Patent
Through Silicon Vias and Holes Metallization by Cu Nanoparticles Coating and Cu Electrodeposition
Dow, Wei-Ping, Shen, Shao-Ping, Lu, Chun-Wei, Chang, Yiu-Hsiang, Kubo, Motonobu, Kamitamari, Tohru, Cheng, Eric, Lin, Jing-Yuan, Hsu, Fu-Chiang
Published in Meeting abstracts (Electrochemical Society) (08.07.2010)
Published in Meeting abstracts (Electrochemical Society) (08.07.2010)
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Journal Article