Search Results - "SHEILA F. CHOPIN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Corrosion of Copper Wire bonded Packages by Chlorine Containing Foreign Particles

Corrosion of Copper Wire bonded Packages by Chlorine Containing Foreign Particles

by Mathew, Varughese, Wikramanayake, Enakshi, Chopin, Sheila F
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

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Conference Proceeding

Post wirebonding coating for prevention of corrosion of wire bonded packages by chlorine containing foreign particles

Post wirebonding coating for prevention of corrosion of wire bonded packages by chlorine containing foreign particles

by Mathew, Varughese, Chopin, Sheila F, Li, Guangming, Xu, Sean
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

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Conference Proceeding

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES

by Low, Boon Yew, Chopin, Sheila F, Lakhera, Nishant
Year of Publication 28.12.2023

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Patent

Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes

Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes

by Low, Boon Yew, Chopin, Sheila F, Lakhera, Nishant
Year of Publication 17.10.2023

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Patent

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES

by Low, Boon Yew, Chopin, Sheila F, Lakhera, Nishant
Year of Publication 11.08.2022

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Patent

System and method for lead frame package degating

System and method for lead frame package degating

by Chopin Sheila F, Mathew Varughese
Year of Publication 23.08.2016

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Patent

Semiconductor device attached to an exposed pad

Semiconductor device attached to an exposed pad

by Mathew, Varughese, Chopin, Sheila F, Koschmieder, Thomas H
Year of Publication 26.02.2019

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Patent

Semiconductor structure with sacrificial anode and method for forming

Semiconductor structure with sacrificial anode and method for forming

by Ding, Min, Roth, Scott S, Mathew, Varughese, Chopin, Sheila F
Year of Publication 05.02.2019

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Patent

SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING

SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING

by MATHEW VARUGHESE, CHOPIN SHEILA F
Year of Publication 29.01.2015

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Patent

Heat spreader for use within a packaged semiconductor device

Heat spreader for use within a packaged semiconductor device

by MATHEW VARUGHESE, CHOPIN SHEILA F
Year of Publication 16.09.2014

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Patent

HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE

HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE

by MATHEW VARUGHESE, CHOPIN SHEILA F
Year of Publication 06.03.2014

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Patent

Semiconductor device

Semiconductor device

by HIGGINS, III LEO M, CHOPIN SHEILA F
Year of Publication 18.08.2015

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Patent

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

by MATHEW Varughese, CHOPIN Sheila F, KOSCHMIEDER Thomas H
Year of Publication 06.04.2017

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Patent

Semiconductor Structure With Sacrificial Anode and Method for Forming

Semiconductor Structure With Sacrificial Anode and Method for Forming

by DING MIN, MATHEW VARUGHESE, CHOPIN SHEILA F, ROTH SCOTT S
Year of Publication 10.11.2016

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Patent

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

by HIGGINS, III LEO M, CHOPIN SHEILA F
Year of Publication 18.09.2014

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Patent

Semiconductor structure with sacrificial anode and passivation layer and method for forming

Semiconductor structure with sacrificial anode and passivation layer and method for forming

by Ding Min, Chopin Sheila F, Roth Scott S, Mathew Varughese
Year of Publication 09.08.2016

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Patent

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

by MATHEW VARUGHESE, CHOPIN SHEILA F, KOSCHMIEDER THOMAS H
Year of Publication 10.03.2016

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Patent

Warpage control using a package carrier assembly

Warpage control using a package carrier assembly

by CHOPIN SHEILA F, YUAN YUAN
Year of Publication 28.09.2010

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Patent

Warpage control using a package carrier assembly

Warpage control using a package carrier assembly

by Yuan, Yuan, Chopin, Sheila F
Year of Publication 28.09.2010

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Patent

Mold compound compatibility test system and methods thereof

Mold compound compatibility test system and methods thereof

by HIGGINS, III LEO M, MATHEW VARUGHESE, CHOPIN SHEILA F
Year of Publication 17.02.2015

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Patent