Electromigration reliability and morphologies of Cu pillar flip-chip solder joints
Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee, Yu-Hsiu Shao, Jiunn Chen
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
The effects of Ag content in the solder on electromigration behavior
Ying-Ta Chiu, Yu-Hsiu Shao, Ping-Feng Yang
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI
HSIAO, Yu-Hsiang, LIN, Kwang-Lung, LEE, Chiu-Wen, SHAO, Yu-Hsiu, LAI, Yi-Shao
Published in Journal of electronic materials (2012)
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Published in Journal of electronic materials (2012)
Journal Article
Reliability and Failure Mechanism of Current-Stressed 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Joints with Cu or Au/Ni/Cu Substrate Pad Metallization
Ying-Ta Chiu, Yu-Hsiu Shao, Yi-Shao Lai
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding
Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
Yi-Shao Lai, Kuo-Ming Chen, Chiu-Wen Lee, Chin-Li Kao, Yu-Hsiu Shao
Published in 2005 7th Electronic Packaging Technology Conference (2005)
Published in 2005 7th Electronic Packaging Technology Conference (2005)
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Conference Proceeding