Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)
DOI, Toshiro K., SESHIMO, Kiyoshi, YAMAZAKI, Tsutomu, OHTSUBO, Masanori, NISHIZAWA, Hideaki, MURAKAMI, Sachi, ICHIKAWA, Daizo, NAKAMURA, Yoshio, MIYASHITA, Tadakazu, KAWAMURA, Yoshihide, TAKAGI, Masataka, KASHIWADA, Hiroshi, AIDA, Hideo
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
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Journal Article
Mode switching control from vibration reduction to positioning for power assisted moving flexible structures
Fujimoto, I., Hara, S., Yamada, Y., Morita, Y., Seshimo, K., Higashi, M.
Published in IECON 2011 - 37th Annual Conference of the IEEE Industrial Electronics Society (01.11.2011)
Published in IECON 2011 - 37th Annual Conference of the IEEE Industrial Electronics Society (01.11.2011)
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Conference Proceeding
Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water
Aida, Hideo, Kim, Seong-Woo, Ikejiri, Kenjiro, Doi, Toshiro, Yamazaki, Tsutomu, Seshimo, Kiyoshi, Koyama, Koji, Takeda, Hidetoshi, Aota, Natsuko
Published in Precision engineering (01.04.2015)
Published in Precision engineering (01.04.2015)
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Journal Article
POLISHING PAD
KASHIWADA FUTOSHI, SESHIMO KIYOSHI, DOI TOSHIRO, TSUKAMOTO KEIICHI, TAKAGI MASATAKA
Year of Publication 12.09.2019
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Year of Publication 12.09.2019
Patent
Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition
Doi, Toshiro K., Seshimo, Kiyoshi, Yamazaki, Tsutomu, Ohtsubo, Masanori, Ichikawa, Daizo, Miyashita, Tadakazu, Takagi, Masataka, Saeki, Taku, Aida, Hideo
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
METHOD FOR POLISHING SEMICONDUCTOR WAFER
KATO MIKIHIRO, KAJIKURA ATSUSHI, MIYAJI KEIJI, DOI TOSHIRO, SESHIMO KIYOSHI, TSUKAMOTO KEIICHI, MIYASHITA CHUICHI
Year of Publication 22.07.2019
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Year of Publication 22.07.2019
Patent
POLISHING APPARATUS
OHTSUBO MASANORI, MIYASHITA TADAKAZU, SESHIMO KIYOSHI, ICHIKAWA DAIZO
Year of Publication 11.01.2017
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Year of Publication 11.01.2017
Patent
WORKPIECE POLISHING DEVICE
WAKABAYASHI TOYOHIRO, YAMAZAKI TSUTOMU, DOI TOSHIRO, SESHIMO KIYOSHI, MIYASHITA CHUICHI
Year of Publication 02.07.2015
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Year of Publication 02.07.2015
Patent
GRINDING PAD AND METHOD OF PRODUCING THE SAME
PHILIPOSSIAN, ARA, SUZUKI, TATSUTOSHI, DOI, TOSHIRO, SESHIMO, KIYOSHI
Year of Publication 12.01.2006
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Year of Publication 12.01.2006
Patent