Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations
Ying Zhang, Yansheng Wang, Jun Xu, Chunchun Sui, Bidyut Sen, Shuai Jin, Jun Fan
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
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Conference Proceeding
Notice of Retraction: An Efficient High-Speed Channel Modeling Method Based on Optimized Design-of-Experiment (DoE) for Artificial Neural Network Training
Kim, Heegon, Sui, Chunchun, Cai, Kevin, Sen, Bidyut, Fan, Jun
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
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Journal Article
An Efficient High-Speed Channel Modeling Method Based on Optimized Design-of-Experiment (DoE) for Artificial Neural Network Training
Kim, Heegon, Sui, Chunchun, Cai, Kevin, Sen, Bidyut, Fan, Jun
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
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Journal Article
Effective and Efficient Modeling of Differential Vias Using Semi-Empirical Approach
Fanghui Ren, Cai, Kevin, Chunchun Sui, Balachandran, Jayaprakash, Bidyut Sen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines With Lossy Conductor and Dielectric
Yong, Shaohui, Khilkevich, Victor, Cai, Xiao-Ding, Sui, Chunchun, Sen, Bidyut, Fan, Jun
Published in IEEE transactions on electromagnetic compatibility (01.04.2020)
Published in IEEE transactions on electromagnetic compatibility (01.04.2020)
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Journal Article
Prepreg and Core Dielectric Permittivity (ϵr) Extraction for Fabricated Striplines' Far-End Crosstalk Modeling
Yong, Shaohui, Penugonda, Srinath, Kim, DongHyun, Khilkevich, Victor, Pu, Bo, Ye, Xiaoning, Gao, Qian, Cai, Xiao-Ding, Sen, Bidyut, Fan, Jun
Published in IEEE transactions on electromagnetic compatibility (01.02.2022)
Published in IEEE transactions on electromagnetic compatibility (01.02.2022)
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Journal Article
Novel Formulations of Multireflections and Their Applications to High-Speed Channel Design
Ouyang, Muqi, Cai, Xiao-Ding, Pu, Bo, Gao, Qian, Penugonda, Srinath, Li, Chaofeng, Sen, Bidyut, Hwang, Chulsoon, Kim, DongHyun
Published in IEEE transactions on signal and power integrity (2022)
Published in IEEE transactions on signal and power integrity (2022)
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Journal Article
Impedance transparency design for PCI-Express Gen 3 SerDes channel on HDI PCBs
Jue Chen, Sen, Bidyut
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
A survey on modeling strategies for high-speed differential Via between two parallel plates
Jun Xu, Yansheng Wang, Ying Zhang, Chunchun Sui, Sen, Bidyut, Shuai Jin, Jun Fan
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
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Conference Proceeding
Machine-Learning-Based Optimization of Tx Equalization Parameters of a High-Speed Channel
Ling, Feng, Dan, Yufeng, Wan, Changhua, Cai, Kevin, Sen, Bidyut
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
Automated 3D discontinuity optimization with speed sensitivity for high-speed Serdes channels
Dong, Qian, Cai, Kevin, Gao, Anna, Sen, Bidyut
Published in 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium (26.07.2021)
Published in 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium (26.07.2021)
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Conference Proceeding
Automated Full-Board SI Scan for High-Speed Applications up to 112Gb/s and Beyond
Cai, Kevin, Gao, Anna, Sen, Bidyut, Wan, Joshua, Ling, Feng
Published in 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium (26.07.2021)
Published in 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium (26.07.2021)
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Conference Proceeding