by Troughton, Joe, Atkinson, Del
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (2019)

by Rudan, Massimo, Brunetti, R. (Rossella), Reggiani, Susanna
Year of Publication 2023

by Rudan, Massimo, Brunetti, Rossella, Reggiani, Susanna
Year of Publication 2023

by Sandeep, V., Pravin, J. Charles, Kumar, S. Ashok
Published in Microelectronics and reliability (01.08.2024)

by Hofer, Vera, Nowak, Thomas, Lewitschnig, Horst
Published in Advanced theory and simulations (01.08.2021)

by Zhao, Shuai, Makis, Viliam, Chen, Shaowei, Li, Yong
Published in IEEE transactions on instrumentation and measurement (01.01.2019)

by Cho, Minkyu, Seo, Jung-Hun, Park, Dong-Wook, Zhou, Weidong, Ma, Zhenqiang
Published in Applied physics letters (06.06.2016)

by Del Alamo, Jesus A.
Published in IEEE electron device letters (01.04.2022)

by Paszkiewicz, Bartlomiej K., Paszkiewicz, Bogdan, Dziedzic, Andrzej
Published in Journal of Engineering (29.04.2022)

by Del Alamo, Jesus A.
Published in IEEE electron device letters (01.07.2022)

by Alamo, Jesus A. Del
Published in IEEE electron device letters (01.10.2022)

by Alamo, Jesus A. Del
Published in IEEE electron device letters (01.01.2023)

by King Liu, Tsu-Jae, Han, Genquan
Published in IEEE electron device letters (01.07.2018)

by Knyazev, Volodymyr, Serkov, Aleksandr, Breslavets, Vitaliy, Yakovenko, Igor
Published in Сучасні інформаційні системи (08.07.2019)

by Abeywickrama, Samith, Zhang, Rui, Wu, Qingqing, Yuen, Chau
Published in IEEE transactions on communications (01.09.2020)

by Zhao, Shuai, Peng, Yingzhou, Yang, Fei, Ugur, Enes, Akin, Bilal, Wang, Huai
Published in IEEE transactions on instrumentation and measurement (2021)

by Wang, Zhen, Wang, Peng, Wang, Fang, Ye, Jiafu, He, Ting, Wu, Feng, Peng, Meng, Wu, Peisong, Chen, Yunfeng, Zhong, Fang, Xie, Runzhang, Cui, Zhuangzhuang, Shen, Liang, Zhang, Qinghua, Gu, Lin, Luo, Man, Wang, Yang, Chen, Huawei, Zhou, Peng, Pan, Anlian, Zhou, Xiaohao, Zhang, Lili, Hu, Weida
Published in Advanced functional materials (01.01.2020)

by Silveyra, Josefina M., Ferrara, Enzo, Huber, Dale L., Monson, Todd C.
Published in Science (American Association for the Advancement of Science) (26.10.2018)

by Gupta, Vipin, Barak, M.S.
Published in International journal of numerical methods for heat & fluid flow (02.01.2024)

by Liu, Tsu-Jae King
Published in IEEE electron device letters (01.12.2016)