DBC Technology for Extremely Thin Flat Heat Pipes
Kamenova, L., Avenas, Y., Schaeffer, C., Tzanova, S., Kapelski, G., Schulz-Harder, J.
Published in IEEE transactions on industry applications (2009)
Published in IEEE transactions on industry applications (2009)
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Journal Article
Package for metal-ceramic substrate, and method for packaging such substrates
BRAEUTIGAM JOHANN, SCHWEIGER HELKO, ERNSTBERGER ERICH, SCHULZ-HARDER JUERGEN
Year of Publication 28.11.2016
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Year of Publication 28.11.2016
Patent
Dbc (direct bond copper) substrate with integrated flat heat pipe
Schulz-Harder, J., Dezord, J.B., Schaeffer, C., Avenas, Y., Puig, O., Rogg, A., Exel, K., Utz-Kistner, A.
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
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Conference Proceeding