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Year of Publication 09.10.2008
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Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection
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Year of Publication 07.12.2006
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Epitaxially coated semiconductor wafer
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Year of Publication 19.05.2005
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Film or layer of semiconducting material, and process for producing the film or layer
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Year of Publication 26.08.2008
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SOI wafer
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Year of Publication 14.11.2007
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Epitaxial coating applying method of semiconductor wafer in chemical vapor deposition reactor, involves exposing back surface of semiconductor wafer to ejection gas containing specific amount of hydrogen
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Year of Publication 02.10.2003
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Silicon wafer and its method of fabrication
FREY, CHRISTOPH, AMMON VON, WILFRIED, DAUB, ERICH, SCHMOLKE, RUEDIGER
Year of Publication 07.08.2002
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Year of Publication 07.08.2002
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