A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
Sharma, Chander Shekhar, Schlottig, Gerd, Brunschwiler, Thomas, Tiwari, Manish K., Michel, Bruno, Poulikakos, Dimos
Published in International journal of heat and mass transfer (01.09.2015)
Published in International journal of heat and mass transfer (01.09.2015)
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Journal Article
Energy efficient hotspot-targeted embedded liquid cooling of electronics
Sharma, Chander Shekhar, Tiwari, Manish K., Zimmermann, Severin, Brunschwiler, Thomas, Schlottig, Gerd, Michel, Bruno, Poulikakos, Dimos
Published in Applied energy (15.01.2015)
Published in Applied energy (15.01.2015)
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Journal Article
Industrial approach to the chip and package reliability of SiC MOSFETs (Invited)
Mengotti, Elena, Bianda, Enea, Baumann, David, Schlottig, Gerd, Canales, Francisco
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill
Straessle, Rahel, Zimmermann, Severin, del Carro, Luca, Zurcher, Jonas, Schlottig, Gerd, Achen, Albert, Hong, Guo, Poulikakos, Dimos, Brunschwiler, Thomas
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2018)
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Journal Article
(Invited) Wafer-Level Integration of Embedded Cooling Approaches
Paredes, Stephan, Madhour, Yassir, Schlottig, Gerd, Ong, Chin Lee, Brunschwiler, Thomas
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
DIAGNOSIS AND PROGNOSIS OF IGBT MODULES
Bianda, Enea, Firla, Marcin, Vulli, Aleksi, Schlottig, Gerd, Orkisz, Michal
Year of Publication 11.04.2024
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Year of Publication 11.04.2024
Patent
DIAGNOSIS AND PROGNOSIS OF IGBT MODULES
Bianda, Enea, Firla, Marcin, Vulli, Aleksi, Schlottig, Gerd, Orkisz, Michal
Year of Publication 20.03.2024
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Year of Publication 20.03.2024
Patent
POWER SEMICONDUCTOR MODULE WITH ACCESSIBLE METAL CLIPS
SCHROEDER, Arne, SCHUDERER, Juergen, SCHLOTTIG, Gerd, PAVLICEK, Niko, LIU, Chunlei
Year of Publication 06.03.2024
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Year of Publication 06.03.2024
Patent
Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
BRUNSCHWILER, Thomas, SCHLOTTIG, Gerd, SONGBO NI, YU LIU, GOICOCHEA, Javier V, ZÜRCHER, Jonas, WOLF, Heiko
Published in Journal of microelectronics and electronic packaging (01.10.2012)
Published in Journal of microelectronics and electronic packaging (01.10.2012)
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Journal Article
Power Semiconductor Module with Accessible Metal Clips
Schuderer, Juergen, Liu, Chunlei, Schroeder, Arne, Pavlicek, Niko, Schlottig, Gerd
Year of Publication 16.02.2023
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Year of Publication 16.02.2023
Patent
POWER SEMICONDUCTOR MODULE WITH ACCESSIBLE METAL CLIPS
SCHROEDER, Arne, SCHUDERER, Juergen, SCHLOTTIG, Gerd, PAVLICEK, Niko, LIU, Chunlei
Year of Publication 17.11.2021
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Year of Publication 17.11.2021
Patent
POWER SEMICONDUCTOR MODULE WITH ACCESSIBLE METAL CLIPS
SCHROEDER, Arne, SCHUDERER, Juergen, SCHLOTTIG, Gerd, PAVLICEK, Niko, LIU, Chunlei
Year of Publication 05.08.2021
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Year of Publication 05.08.2021
Patent