Verfahren zur Lötstopp-Strukturierung von Erhebungen auf Wafern
UHLENDORF, INGO, SCHENK, ANDRE, WOLLANKE, ALEXANDER, BRINTZINGER, AXEL
Year of Publication 22.11.2007
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Year of Publication 22.11.2007
Patent
Method for the solder-stop structuring of elevations on wafers
Brintzinger, Axel, Uhlendorf, Ingo, Schenk, Andre, Wollanke, Alexander
Year of Publication 19.07.2005
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Year of Publication 19.07.2005
Patent
Method for the solder-stop structuring of elevations on wafers
Brintzinger, Axel, Uhlendorf, Ingo, Schenk, Andre, Wollanke, Alexander
Year of Publication 06.05.2004
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Year of Publication 06.05.2004
Patent
Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing
UHLENDORF, INGO, SCHENK, ANDRE, WOLLANKE, ALEXANDER, BRINTZINGER, AXEL
Year of Publication 25.03.2004
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Year of Publication 25.03.2004
Patent