Integrated circuit package including inward bent leads
Meyers, Michael L, Saye, Richard J, Koduri, Sreenivasan K, Eisenhart, Scott F
Year of Publication 17.11.2020
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Year of Publication 17.11.2020
Patent
INTEGRATED CIRCUIT PACKAGE INCLUDING INWARD BENT LEADS
SAYE, RICHARD J, EISENHART, SCOTT F, MEYERS, MICHAEL L, KODURI, SREENIVASAN K
Year of Publication 28.05.2020
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Year of Publication 28.05.2020
Patent
Integrated circuit package including inward bent leads
MEYERS MICHAEL L, EISENHART SCOTT F, KODURI SREENIVASAN K, SAYE RICHARD J
Year of Publication 11.06.2021
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Year of Publication 11.06.2021
Patent