3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACH
LEE KEVIN J, KOTHARI HITEN, MA HANG SHING, BOHR MARK T, PELTO CHRISTOPHER M, SATTIRAJU SESHU V, YEOH ANDREW W
Year of Publication 04.07.2014
Get full text
Year of Publication 04.07.2014
Patent
BARRIER MATERIALS BETWEEN BUMPS AND PADS
PELTO, Christopher M, SATTIRAJU, Seshu V, RAORANE, Digvijay A, GOWRISHANKAR, Shravan, HWANG, Ehren, ZELL, Zachary A
Year of Publication 03.11.2021
Get full text
Year of Publication 03.11.2021
Patent
BARRIER MATERIALS BETWEEN BUMPS AND PADS
PELTO, Christopher M, SATTIRAJU, Seshu V, RAORANE, Digvijay A, GOWRISHANKAR, Shravan, HWANG, Ehren, ZELL, Zachary A
Year of Publication 25.02.2021
Get full text
Year of Publication 25.02.2021
Patent
BARRIER MATERIALS BETWEEN BUMPS AND PADS
PELTO, Christopher M, SATTIRAJU, Seshu V, RAORANE, Digvijay A, GOWRISHANKAR, Shravan, HWANG, Ehren, ZELL, Zachary A
Year of Publication 28.10.2020
Get full text
Year of Publication 28.10.2020
Patent
BARRIER MATERIALS BETWEEN BUMPS AND PADS
PELTO, Christopher M, SATTIRAJU, Seshu V, RAORANE, Digvijay A, GOWRISHANKAR, Shravan, HWANG, Ehren, ZELL, Zachary A
Year of Publication 27.06.2019
Get full text
Year of Publication 27.06.2019
Patent
CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING AN ELECTROLYTIC NICKEL LAYER
GUHA, Sudipto, KOTHARI, Hiten, SATTIRAJU, Seshu V, GUNAWAN, Aloysius A, BHATIA, Ashish, GOWRISHANKAR, Shravan, MUIRHEAD, John, GANESAN, Krishna Prakash, PATTABHIRAMAN, Sriram, SRIRAM, Vinay, ARYASOMAYAJULA, Lavanya
Year of Publication 01.08.2019
Get full text
Year of Publication 01.08.2019
Patent
ROUGHNESS MASK FOR SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME
KOTHARI, Hiten, SATTIRAJU, Seshu V, LYTLE, Wayne M, GANESAN, Krishna Prakash, SINGH, Gurpreet
Year of Publication 30.03.2017
Get full text
Year of Publication 30.03.2017
Patent
CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING AN ELECTROLYTIC NICKEL LAYER
GUHA, Sudipto, KOTHARI, Hiten, SATTIRAJU, Seshu V, GUNAWAN, Aloysius A, BHATIA, Ashish, GOWRISHANKAR, Shravan, MUIRHEAD, John, GANESAN, Krishna Prakash, PATTABHIRAMAN, Sriram, SRIRAM, Vinay, ARYASOMAYAJULA, Lavanya
Year of Publication 05.04.2018
Get full text
Year of Publication 05.04.2018
Patent
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
Bohr Mark T, Sattiraju Seshu V, Ma Hang-Shing, Yeoh Andrew W, Lee Kevin J, Pelto Christopher M, Kothari Hiten
Year of Publication 27.12.2016
Get full text
Year of Publication 27.12.2016
Patent
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACH
LEE KEVIN J, KOTHARI HITEN, BOHR MARK T, PELTO CHRISTOPHER M, SATTIRAJU SESHU V, YEOH ANDREW W, MA HANG-SHING
Year of Publication 17.12.2015
Get full text
Year of Publication 17.12.2015
Patent
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
LEE KEVIN J, KOTHARI HITEN, BOHR MARK T, PELTO CHRISTOPHER M, SATTIRAJU SESHU V, YEOH ANDREW W, MA HANG-SHING
Year of Publication 22.09.2015
Get full text
Year of Publication 22.09.2015
Patent
Roughness mask for semiconductor devices and methods for making the same
SINGH, GURPREET, GANESAN, KRISHNA PRAKASH, LYTLE, WAYNE M, SATTIRAJU, SESHU V, KOTHARI, HITEN
Year of Publication 01.07.2017
Get full text
Year of Publication 01.07.2017
Patent
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACH
LEE KEVIN J, KOTHARI HITEN, BOHR MARK T, PELTO CHRISTOPHER M, SATTIRAJU SESHU V, YEOH ANDREW W, MA HANG-SHING
Year of Publication 31.10.2013
Get full text
Year of Publication 31.10.2013
Patent
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BACKSIDE METAL REDISTRIBUTION LINES COMBINED WITH THROUGH-SILICON VIAS
MA, HANG-SHING, LEE, KEVIN J, BOHR, MARK T, SATTIRAJU, SESHU V, KOTHARI, HITEN, YEOH, ANDREW W, PELTO, CHRISTOPHER M
Year of Publication 02.05.2013
Get full text
Year of Publication 02.05.2013
Patent