by Haddad, G., Sandborn, P. A., Pecht, M. G.
Published in Wind energy (Chichester, England) (01.05.2014)

by Sandborn, P., Prabhakar, V., Ahmad, O.
Published in Microelectronics and reliability (01.02.2011)

by Galar, D, Kumar, U, Sandborn, P, Morant, A
Published in Journal of physics. Conference series (28.05.2012)

by Sandborn, P.
Published in Annual Reliability and Maintainability Symposium, 2005. Proceedings (2005)

by Sandborn, Peter A.
Published in IEEE transactions on components and packaging technologies (01.12.2007)

by Singh, P., Sandborn, P.
Published in Annual Reliability and Maintainability Symposium, 2005. Proceedings (2005)

by Kleyner, A., Sandborn, P., Boyle, J.
Published in Annual Symposium Reliability and Maintainability, 2004 - RAMS (2004)

by Solomon, R., Sandborn, P.A., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.12.2000)

by Trichy, T., Sandborn, P., Raghavan, R., Sahasrabudhe, S.
Published in Proceedings International Test Conference 2001 (Cat. No.01CH37260) (2001)

by Haddad, G., Sandborn, P. A., Pecht, M. G.
Published in IEEE transactions on reliability (01.12.2012)

by Zhen Shi, Sandborn, P.
Published in International Test Conference, 2003. Proceedings. ITC 2003 (2003)

by Sandborn, P., Sandborn, P.A.
Published in IEEE transactions on advanced packaging (01.02.2008)

by Sandborn, P.A, Spletter, P
Published in Microelectronics international (01.04.2000)

by Feldman, K., Jazouli, T., Sandborn, P.A.
Published in IEEE transactions on reliability (01.06.2009)

by Sandborn, P.A., Rao, A., Blakey, P.A.
Published in IEEE transactions on electron devices (01.07.1989)

by Scanff, E., Feldman, K.L., Ghelam, S., Sandborn, P., Glade, M., Foucher, B.
Published in Microelectronics and reliability (01.12.2007)

by Kleyner, Andre, Sandborn, Peter
Published in Reliability engineering & system safety (01.06.2005)

by Rodriguez, R J, Rogriguez, R P, Cook, S D, Sandborn, P M
Published in Journal of sports medicine and physical fitness (01.03.1990)

by Sandborn, P.A., Herald, T.E., Houston, J., Singh, P.
Published in IEEE transactions on components and packaging technologies (01.12.2003)

by Jingsong Xie, Hillman, C., Sandborn, P., Pecht, M.G., Hassenzadeh, A., DeDonato, D.
Published in IEEE transactions on components and packaging technologies (01.03.2000)