Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique
Zhang, Zheng, Chen, Chuantong, Suetake, Aiji, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki
Published in IEEE transactions on power electronics (01.02.2023)
Published in IEEE transactions on power electronics (01.02.2023)
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Journal Article
Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique
Zhang, Zheng, Suetake, Aiji, Chen, Chuantong, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
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Conference Proceeding