Search Results - "SALAMA ISLAM A" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Substrate patch reconstitution options

Substrate patch reconstitution options

by JEN, WEI-LUN KANE, HARIRI, HAIFA, SALAMA, ISLAM A, ALUR, AMRUTHAVALLI PALLAVI
Year of Publication 01.01.2021

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Patent

LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE BUILD-UP LAYERS

LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE BUILD-UP LAYERS

by LOTZ STEFANIE M, BOYAPATI SRI RANGA, SHARMA NIKHIL, ZHANG QINGLEI, SALAMA ISLAM A, ZHANG CHONG
Year of Publication 01.10.2015

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Patent

METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

by SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Year of Publication 06.10.2016

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Patent

METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

by Salama Islam A, Eid Feras, Lee Kyu Oh, Kong Lay Wai, Zhou Zheng, Oster Sasha N, Soto Gonzalez Javier
Year of Publication 29.09.2016

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Patent

SYSTEMS AND METHODS TO LAMINATE PASSIVES ONTO SUBSTRATE

SYSTEMS AND METHODS TO LAMINATE PASSIVES ONTO SUBSTRATE

by SALAMA ISLAM A, SEH HUANKIAT, MIN YONGKI
Year of Publication 10.02.2011

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Patent

Systems and methods to laminate passives onto substrate

Systems and methods to laminate passives onto substrate

by SALAMA ISLAM A, SEH HUANKIAT, MIN YONGKI
Year of Publication 23.11.2010

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Patent

Systems and methods to laminate passives onto substrate

Systems and methods to laminate passives onto substrate

by Seh, Huankiat, Min, Yongki, Salama, Islam A
Year of Publication 23.11.2010

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Patent

Device packaging with substrates having embedded lines and metal defined pads

Device packaging with substrates having embedded lines and metal defined pads

by ROY MIHIR K, HLAD MARK S, SALAMA ISLAM A, LEE KYU OH, WU TAO, LIU YUELI
Year of Publication 31.05.2016

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Patent

Integrated circuit structures with recessed conductive contacts for package on package

Integrated circuit structures with recessed conductive contacts for package on package

by CHAVALI, SRI CHAITRA JYOTSNA, VISWANATH, RAM S, SALAMA, ISLAM A, SABI, BABAK, SANKMAN, ROBERT L, LEE, KYU-OH
Year of Publication 21.05.2021

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Patent

LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED CIRCUIT THIN FILM CAPACITOR

LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED CIRCUIT THIN FILM CAPACITOR

by SALAMA ISLAM A, MIN YONGKI
Year of Publication 27.09.2007

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Patent

USE OF SACRIFICIAL MATERIAL TO COMPENSATE FOR THICKNESS VARIATION IN MICROELECTRONIC SUBSTRATES

USE OF SACRIFICIAL MATERIAL TO COMPENSATE FOR THICKNESS VARIATION IN MICROELECTRONIC SUBSTRATES

by SALAMA, Islam A, SHARMA, Nikhil, WU, Tao, CHEN, Chi-Mon, LI, Yi, LIU, Yueli, ZHOU, Zheng, ALUR, Amruthavalli P
Year of Publication 09.03.2017

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Patent

PACKAGE ASSEMBLY CONFIGURATIONS FOR MULTIPLE DIES AND ASSOCIATED TECHNIQUES

PACKAGE ASSEMBLY CONFIGURATIONS FOR MULTIPLE DIES AND ASSOCIATED TECHNIQUES

by ROY MIHIR K, SALAMA ISLAM A, LIU YUELI, VISWANATH RAM S
Year of Publication 15.01.2015

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Patent

System and method for advanced solder bumping using a disposable mask

System and method for advanced solder bumping using a disposable mask

by SALAMA ISLAM A, PANG MENGZHI
Year of Publication 28.06.2007

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Patent

HYBRID-CORE THROUGH HOLES AND VIAS

HYBRID-CORE THROUGH HOLES AND VIAS

by SALAMA, ISLAM A, ROY, MIHIR K, LI, YONGGANG
Year of Publication 16.08.2012

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Patent

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS

by ROY MIHIR K, HLAD MARK S, SALAMA ISLAM A, LEE KYU OH, WU TAO, LIU YUELI
Year of Publication 05.11.2015

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Patent

HYBRID-CORE THROUGH HOLES AND VIAS

HYBRID-CORE THROUGH HOLES AND VIAS

by SALAMA, ISLAM A, ROY, MIHIR K, LI, YONGGANG
Year of Publication 14.06.2012

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Patent

High density interconnection of microelectronic devices

High density interconnection of microelectronic devices

by Salama Islam A, Osborn Tyler N, Aygun Kemal, Swan Johanna M, Guzek John S, Nelson Christopher J, Eid Feras, Karhade Omkar G, Lambert William J, Gealer Charles A, Deshpande Nitin A, Oster Sasha N
Year of Publication 12.12.2017

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Patent

Integrated circuit structures with interposers having recesses

Integrated circuit structures with interposers having recesses

by LEE KYU-OH, SALAMA ISLAM A
Year of Publication 02.03.2018

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Patent

IC package with prefabricated film capacitor

IC package with prefabricated film capacitor

by SALAMA ISLAM A, MIN YONGKI
Year of Publication 05.10.2006

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Patent

Device packaging with substrates having embedded lines and metal defined pads

Device packaging with substrates having embedded lines and metal defined pads

by ROY MIHIR K, HLAD MARK S, SALAMA ISLAM A, LEE KYU OH, WU TAO, LIU YUELI
Year of Publication 28.07.2015

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Patent

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