Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
Sakuma, Katsuyuki, Pancoast, Leanna, Yao, Yiping, Knickerbocker, John
Published in Micromachines (Basel) (29.12.2023)
Published in Micromachines (Basel) (29.12.2023)
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Journal Article
Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction
Sakuma, Katsuyuki, Abrami, Avner, Blumrosen, Gaddi, Lukashov, Stanislav, Narayanan, Rajeev, Ligman, Joseph W., Caggiano, Vittorio, Heisig, Stephen J.
Published in Scientific reports (21.12.2018)
Published in Scientific reports (21.12.2018)
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Journal Article
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
Blumrosen, Gaddi, Sakuma, Katsuyuki, Rice, John Jeremy, Knickerbocker, John
Published in IEEE access (2020)
Published in IEEE access (2020)
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Journal Article
Effects of Excimer Irradiation Treatment on Thermocompression Au--Au Bonding
Unami, Naoko, Sakuma, Katsuyuki, Mizuno, Jun, Shoji, Shuichi
Published in Japanese Journal of Applied Physics (01.06.2010)
Published in Japanese Journal of Applied Physics (01.06.2010)
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Journal Article
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack
Matsumoto, Keiji, Ibaraki, Soichiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kikuchi, Hidekazu, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
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Conference Proceeding
Investigations of cooling solutions for three-dimensional (3D) chip stacks
Matsumoto, Keiji, Ibaraki, Soichiro, Sato, Masaaki, Sakuma, Katsuyuki, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
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Conference Proceeding
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
Aoki, Toyohiro, Sakuma, Katsuyuki, Mori, Hiroyuki, Nakamura, Koki, Hisada, Takashi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements
Matsumoto, K., Ibaraki, S., Sueoka, K., Sakuma, K., Kikuchi, H., Orii, Y., Yamada, F.
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
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Conference Proceeding
New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method
Takuji Matsumoto, Takuji Matsumoto, Masakazu Satoh, Masakazu Satoh, Katsuyuki Sakuma, Katsuyuki Sakuma, Hiroyuki Kurino, Hiroyuki Kurino, Nobuaki Miyakawa, Nobuaki Miyakawa, Hikotaro Itani, Hikotaro Itani, Mitsumasa Koyanagi, Mitsumasa Koyanagi
Published in Japanese Journal of Applied Physics (01.03.1998)
Published in Japanese Journal of Applied Physics (01.03.1998)
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Journal Article
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
Sakuma, Katsuyuki, Tunga, Krishna, Webb, Buck, Ramachandran, Koushik, Interrante, Marcus, Hsichang Liu, Angyal, Matthew, Berger, Daniel, Knickerbocker, John, Iyer, Subramanian
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
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Journal Article
Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip
Wook Lee, Kang, Tae Park, Tomonori Nakamura, Yoon Kim, Hiroaki Shimazutsu, Hiroyuki Kurino, Hiroyuki Kurino, Mitsumasa Koyanagi, Mitsumasa Koyanagi
Published in Japanese Journal of Applied Physics (2000)
Published in Japanese Journal of Applied Physics (2000)
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Journal Article