Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
Maeshima, Takashi, Ikehata, Hideaki, Terui, Kenichirou, Sakamoto, Yoshitsugu
Published in Materials & design (05.08.2016)
Published in Materials & design (05.08.2016)
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Journal Article
SEMICONDUCTOR DEVICE
KIMURA Ryo, SAKAMOTO Yoshitsugu, KOJIMA Yuji, SATO Takashi, OKUMURA Tomomi
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
SEMICONDUCTOR DEVICE
KIMURA Ryo, SAKAMOTO Yoshitsugu, KOJIMA Yuji, SATO Takashi, OKUMURA Tomomi
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
SEMICONDUCTOR DEVICE
KIMURA Ryo, SAKAMOTO Yoshitsugu, KOJIMA Yuji, SATO Takashi, OKUMURA Tomomi
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
SEMICONDUCTOR DEVICE
YOSHIKAWA Hiroki, KAIZU Ryoichi, SAKAMOTO Yoshitsugu, INABA Yuki, YAMAGISHI Tetsuto
Year of Publication 03.02.2022
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Year of Publication 03.02.2022
Patent
SEMICONDUCTOR DEVICE
KAIZU Ryoichi, SAKAMOTO Yoshitsugu, NOMURA Takumi, INABA Yuki, YAMAGISHI Tetsuto
Year of Publication 23.04.2020
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Year of Publication 23.04.2020
Patent
SOLDER PASTE
HAYASHI HIROMASA, SAKAMOTO YOSHITSUGU, KOROKI MOTOKI, OKADA SAKIE, ITOYAMA TARO, ISEKI HIROAKI
Year of Publication 04.07.2013
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Year of Publication 04.07.2013
Patent
SEMICONDUCTOR DEVICE BONDING MATERIAL
SAKAMOTO YOSHITSUGU, OHNISHI TSUKASA, YOSHIKAWA SHUNSAKU, YAMANAKA YOSHIE, TADOKORO KENZO, YAMADA HIROYUKI
Year of Publication 29.04.2013
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Year of Publication 29.04.2013
Patent
SEMICONDUCTOR DEVICE
SAKAMOTO, Yoshitsugu, KOJIMA, Yuji, KIMURA, Ryo, OKUMURA, Tomomi, SATO, Takashi
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
Patent
SEMICONDUCTOR DEVICE BONDING MATERIAL
SAKAMOTO YOSHITSUGU, OHNISHI TSUKASA, YOSHIKAWA SHUNSAKU, YAMANAKA YOSHIE, TADOKORO KENZO, YAMADA HIROYUKI
Year of Publication 09.02.2012
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Year of Publication 09.02.2012
Patent
Terminal member made of plurality of metal layers between two heat sinks
Kaizu, Ryoichi, Sakamoto, Yoshitsugu, Nomura, Takumi, Inaba, Yuki, Yamagishi, Tetsuto
Year of Publication 25.07.2023
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Year of Publication 25.07.2023
Patent
SEMICONDUCTOR DEVICE
INABA, Yuki, SAKAMOTO, Yoshitsugu, YOSHIKAWA, Hiroki, YAMAGISHI, Tetsuto, KAIZU, Ryoichi
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent
METHOD FOR BRAZING AND BRAZED STRUCTURE
HASEGAWA, TSUYOSHI, SAKAMOTO, YOSHITSUGU, KAJIKAWA, SHUNJI, ISHIO, MASAAKI, HAYASHI, TAKAYUKI
Year of Publication 07.07.2005
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Year of Publication 07.07.2005
Patent
Packaging technology of power module for automotive applications
Shimozuma, Ayako, Hayashi, Hiromasa, Higuchi, Shingo, Sakamoto, Yoshitsugu, Okada, Sakie
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
SEMICONDUCTOR DEVICE
YAMAGISHI, TETSUTO, SAKAMOTO, YOSHITSUGU, INABA, YUKI, KAIZU, RYOICHI, NOMURA, TAKUMI
Year of Publication 29.07.2021
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Year of Publication 29.07.2021
Patent
FOAM SOLDER AND ELECTRONIC COMPONENT
HIRANO, NAOHIKO, TSURUTA, KAICHI, SAKAMOTO, YOSHITSUGU, OKUMURA, TOMOMI, ISHII, TAKASHI, UESHIMA, MINORU
Year of Publication 08.11.2007
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Year of Publication 08.11.2007
Patent
FORMED SOLDER AND PROCESS FOR PRODUCING THE SAME
HIRANO, NAOHIKO, TSURUTA, KAICHI, SAKAMOTO, YOSHITSUGU, TANAHASHI, AKIRA, SOGA, SATOSHI, ISHII, TAKASHI
Year of Publication 22.03.2007
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Year of Publication 22.03.2007
Patent
HALBLEITERVORRICHTUNG
Kaizu, Ryoichi, Sakamoto, Yoshitsugu, Nomura, Takumi, Inaba, Yuki, Yamagishi, Tetsuto
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
Patent