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"SAKAGAWA, NOBUO"
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"SAKAGAWA, NOBUO"
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Through-Hole Filling by Copper Electroplating
by
Dow, Wei-Ping
,
Chen, Hsiang-Hao
,
Yen, Ming-Yao
,
Chen, Wei-Hsiang
,
Hsu, Kao-Hsuang
,
Chuang, Po-Yao
,
Ishizuka, Hiroshi
,
Sakagawa
,
Nobuo
,
Kimizuka, Ryoichi
Published in
Journal of the Electrochemical Society
(2008)
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ADDITIVE FOR COPPER PLATING AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUBSTRATE THEREWITH
by
KIMIZUKA, RYOICHI
,
ISHIZUKA, HIROSHI
,
SAKAGAWA
,
NOBUO
,
DOW, WEI-PING
Year of Publication
23.02.2006
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Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith
by
SAKAGAWA NOBUO
,
ISHIZUKA HIROSHI
,
DOW WEI-PING
,
KIMIZUKA RYOICHI
Year of Publication
17.04.2008
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Additive for copper plating and process for producing electronic circuit substrate therewith
by
ISHIZUKA HIROSHI,
SAKAGAWA NOBUO
,KIMIZUKA RYOICHI,DOU WEIPING
Year of Publication
11.07.2007
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ADDITIVE FOR COPPER PLATING AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT SUBSTRATE THEREWITH
by
SAKAGAWA NOBUO
,
ISHIZUKA HIROSHI
,
DOW WEI PING
,
KIMIZUKA RYOICHI
Year of Publication
08.05.2007
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