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Interposer for multi-chip electronics packaging
by
Majumdar, Arunava
,
Coso, Dusan
,
Sadat
,
Seid H
Year of Publication
07.04.2020
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INTERPOSER FOR MULTI-CHIP ELECTRONICS PACKAGING
by
MAJUMDAR ARUNAVA
,
SADAT SEID H
,
COSO DUSAN
Year of Publication
05.05.2016
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Patent
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chemistry
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Topic
basic electric elements
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casings or constructional details of electric apparatus
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electric solid state devices not otherwise provided for
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electric techniques not otherwise provided for
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electricity
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manufacture of assemblages of electrical components
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esp@cenet
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