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Journal Article
Microelectronic assembly with glass substrate and magnetic core inductor
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Conformal power delivery structure for direct chip attach architecture
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Year of Publication 28.03.2023
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Year of Publication 28.03.2023
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Microelectronic assemblies with glass substrates and magnetic core inductors
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Year of Publication 16.12.2022
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Year of Publication 21.04.2020
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Year of Publication 21.04.2020
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Year of Publication 28.03.2023
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Year of Publication 28.03.2023
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Fine-grained decomposition server architecture
KARNIK TANAY, N.NASSIF, SWAN JOHANNA M, CHANDWANI NILESH, SEIBOTH, J ¨ 1 RGEN, MOLNAR CARLETON L, ELSHERBINI ADEL A, LIFF SHAWNA M, MUNOZ RICARDO JORGE, PASDAST GERALD S, NIKONOV DMITRI E, BHARATH KRISHNA
Year of Publication 09.02.2024
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Year of Publication 09.02.2024
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Fine-grained disaggregated server architecture
KARNIK, TANAY, PASDAST, GERALD S, MUNOZ, ROBERT J, ELSHERBINI, ADEL A, SEBOT, JULIEN, LIFF, SHAWNA M, MOLNAR, CARLETON L, BHARATH, KRISHNA, NIKONOV, DMITRI E, CHANDWANI, NEELAM, NASSIF, NEVINE, SWAN, JOHANNA M
Year of Publication 16.07.2023
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Year of Publication 16.07.2023
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Microelectronic assemblies with inductors in direct bonding regions
PASDAST, GERALD S, EID, FERAS, ELSHERBINI, ADEL A, LIFF, SHAWNA M, BHARATH, KRISHNA, THEN, HAN WUI, O'BRIEN, KEVIN P, JUN, KI-MIN, KABIR, MOHAMMAD ENAMUL, ALEKSOV, ALEKSANDAR, SWAN, JOHANNA M
Year of Publication 16.07.2022
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Year of Publication 16.07.2022
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Direct bonding in microelectronic assemblies
EID, FERAS, ELSHERBINI, ADEL A, LIFF, SHAWNA M, BHARATH, KRISHNA, THEN, HAN WUI, JUN, KI-MIN, KABIR, MOHAMMAD ENAMUL, ALEKSOV, ALEKSANDAR, SWAN, JOHANNA M
Year of Publication 01.07.2022
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Year of Publication 01.07.2022
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Enhanced integrated circuit component power delivery
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Year of Publication 01.09.2022
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Year of Publication 01.09.2022
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High performance integrated rf passives using dual lithography process
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Year of Publication 21.11.2021
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Year of Publication 21.11.2021
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