On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F, Rzepka, Sven, Schneider-Ramelow, Martin
Published in Micromachines (Basel) (31.05.2020)
Published in Micromachines (Basel) (31.05.2020)
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Journal Article
Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, Parisa, Vogel, Dietmar, Rodriguez, Raul D., Sheremet, Evgeniya, Zahn, Dietrich R.T., Rzepka, Sven, Michel, Bernd
Published in Microelectronic engineering (02.04.2015)
Published in Microelectronic engineering (02.04.2015)
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Journal Article
Building reliable FE simulation models for a better behavior prediction of power electronic systems
Moller, Heiner, Dudek, Rainer, Otto, Alexander, Rzepka, Sven
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Digital Twin-Based Lifetime Estimation of SiC Power Modules
Mathew, Anu, Rzepka, Sven, Heimler, Patrick, Xie, Dong, Alaluss, Mohamed, Basler, Thomas
Published in 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (02.06.2024)
Published in 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (02.06.2024)
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Conference Proceeding
The effects of underfill on the reliability of flip chip solder joints
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Conference Proceeding
Journal Article
Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, Daniel, Rzepka, Sven, Hiller, Karla
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Journal Article
Machine learning based meta-models for sensorless thermal load prediction
Riegel, Daniel, Gromala, Przemyslaw Jakub, Han, Bongtae, Rzepka, Sven
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
New Insight Into Defects and Degradation Kinetics in Lead Zirconate Titanate
Reis, Daniel Monteiro Diniz, Rzepka, Sven, Hiller, Karla
Published in 2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF) (01.07.2020)
Published in 2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF) (01.07.2020)
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Conference Proceeding
Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges
Otto, Alexander, Dudek, Rainer, Kolas, Kshitij, Mathew, Anu, Scherf, Christina, Rzepka, Sven
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Leakage Current in Low-Temperature PVD PZT Films
Reis, Daniel Monteiro Diniz, Rzepka, Sven, Hiller, Karla
Published in 2019 IEEE International Symposium on Applications of Ferroelectrics (ISAF) (01.07.2019)
Published in 2019 IEEE International Symposium on Applications of Ferroelectrics (ISAF) (01.07.2019)
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Conference Proceeding
Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, Rainer, Kreyssig, Kerstin, Rzepka, Sven, Novak, Michael, Gruebl, Wolfgang, Fruehauf, Peter, Weigert, Andreas
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, John, Dehé, Alfons, Auerswald, Ellen, Dudek, Rainer, Vogel, Dietmar, Michel, Bernd, Rzepka, Sven
Published in Microsystem technologies : sensors, actuators, systems integration (01.03.2016)
Published in Microsystem technologies : sensors, actuators, systems integration (01.03.2016)
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Journal Article
Characterization of partial discharge performance of die attach adhesives
Schaller, Rainer, Strutz, Volker, Theuss, Horst, Dudek, Rainer, Rzepka, Sven
Published in Materials today : proceedings (2017)
Published in Materials today : proceedings (2017)
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Journal Article
A multilayer PCB material modeling approach based on laminate theory
Rzepka, S., Kramer, F., Grassme, O., Lienig, J.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Reliability investigations for high temperature interconnects
Dudek, Rainer, Sommer, Peter, Fix, Andreas, Trodler, Joerg, Rzepka, Sven, Michel, Bernd
Published in Soldering & surface mount technology (01.01.2014)
Published in Soldering & surface mount technology (01.01.2014)
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Journal Article