Water Penetration through a Superhydrophobic Mesh During a Drop Impact
Ryu, Seunggeol, Sen, Prosenjit, Nam, Youngsuk, Lee, Choongyeop
Published in Physical review letters (06.01.2017)
Published in Physical review letters (06.01.2017)
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Journal Article
Anisotropic drop spreading on superhydrophobic grates during drop impact
Han, Jeonghoon, Ryu, Seunggeol, Kim, Hyunsik, Sen, Prosenjit, Choi, Dukhyun, Nam, Youngsuk, Lee, Choongyeop
Published in Soft matter (2018)
Published in Soft matter (2018)
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Journal Article
Effective Substrate Thermal Conductivity Modeling Method Extracted from Detailed Pattern for Premium SOC Packages
Hwang, Seungtae, Lee, Bang weon, Kim, Taehwan, Hyun, Younghoon, Hwang, Heejung, Ryu, Seunggeol, Choi, Mina, Kim, Youngdeuk, Oh, DanKyung Suk
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials
Ki, Seokkan, Shim, Jaehwan, Oh, Seungtae, Koh, Eunjoo, Seo, Donghyun, Ryu, Seunggeol, Kim, Jaechoon, Nam, Youngsuk
Published in International journal of heat and mass transfer (01.05.2021)
Published in International journal of heat and mass transfer (01.05.2021)
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Journal Article
Superhydrophilic catenoidal aluminum micropost evaporator wicks
Bang, Soosik, Ryu, Seunggeol, Ki, Seokkan, Song, Kyounghwan, Kim, Jinwook, Kim, Joongnyon, Nam, Youngsuk
Published in International journal of heat and mass transfer (01.09.2020)
Published in International journal of heat and mass transfer (01.09.2020)
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Journal Article
Performance Analysis of Gravity-Driven Oil–Water Separation Using Membranes with Special Wettability
Oh, Seungtae, Ki, Seokkan, Ryu, Seunggeol, Shin, Myung Chul, Lee, Jinki, Lee, Choongyeop, Nam, Youngsuk
Published in Langmuir (18.06.2019)
Published in Langmuir (18.06.2019)
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Journal Article
Heat transfer and capillary performance of dual-height superhydrophilic micropost wicks
Ryu, Seunggeol, Lee, Wonchul, Nam, Youngsuk
Published in International journal of heat and mass transfer (01.06.2014)
Published in International journal of heat and mass transfer (01.06.2014)
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Journal Article
Anisotropic drop spreading on superhydrophobic grates during drop impactElectronic supplementary information (ESI) available. See DOI: 10.1039/c8sm00259b
Han, Jeonghoon, Ryu, Seunggeol, Kim, Hyunsik, Sen, Prosenjit, Choi, Dukhyun, Nam, Youngsuk, Lee, Choongyeop
Year of Publication 16.05.2018
Year of Publication 16.05.2018
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Journal Article
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
Ryu, Seunggeol, Kim, Keungbeum, Kim, Jaechoon, Jang, Eonsoo, Oh, Kyungsuk
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
Patent
Integrated circuit semiconductor device
Ryu, Seunggeol, Kim, Keungbeum, Kim, Jaechoon, Jang, Eonsoo, Oh, Kyungsuk
Year of Publication 11.06.2024
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Year of Publication 11.06.2024
Patent
Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-based Thermal Interface Materials
Ki, Seokkan, Shim, Jaehwan, Oh, Seungtae, Ryu, Seunggeol, Kim, Jaechoon, Nam, Youngsuk
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Assessment of Thermal-aware Floorplans in a 3D IC for Server Applications
Jung, Ki Wook, Cho, Eunho, Jo, Sungeun, Ryu, Seunggeol, Kim, Jaechoon, Oh, Dan Kyung Suk
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding