3D electromagnetic chip package simulation for high-speed serial interface application
Rydygier, A., Kakerow, R., Munteanu, I., Buchmann, M., Muller, M.
Published in 2008 International Conference on Signals and Electronic Systems (01.09.2008)
Published in 2008 International Conference on Signals and Electronic Systems (01.09.2008)
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Conference Proceeding
Plasmodium knowlesi as a Threat to Global Public Health
Wesolowski, R., Ludwik Rydygier Collegium Medicum of Nicolaus Copernicus University, Bydgoszcz, Poland, Wozniak, A., Ludwik Rydygier Collegium Medicum of Nicolaus Copernicus University, Bydgoszcz, Poland, Celestyna, M.K., Ludwik Rydygier Collegium Medicum of Nicolaus Copernicus University, Bydgoszcz, Poland, Karolina, S.G., Ludwik Rydygier Collegium Medicum of Nicolaus Copernicus University, Bydgoszcz, Poland
Published in Korean journal of parasitology (01.10.2015)
Published in Korean journal of parasitology (01.10.2015)
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Journal Article