A wafer-scale 3-D circuit integration technology
Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.
Published in IEEE transactions on electron devices (01.10.2006)
Published in IEEE transactions on electron devices (01.10.2006)
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Journal Article
A Low-Temperature Nickel Silicide Process for Wafer Bonding and High-Density Interconnects
Smith, Melissa A., Holihan, Eric, Duncan, Bradley P., McRae, James C., Miller, Paul, Stull, Corey, Pinelli, Gianni, Yost, Donna-Ruth Webb, Racz, Livia M.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
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Journal Article
InAlN/GaN-on-Si HEMT with 4.5 W/mm in a 200-mm CMOS-Compatible MMIC Process for 3D Integration
Warnock, Shireen, Chen, Chang-Lee, Knechtl, Jeffrey, Molnar, Richard, Yost, Donna-Ruth, Cook, Matthew, Stull, Corey, Johnson, Ryan, Galbraith, Christopher, Daulton, Jeffrey, Hu, WeiLin, Pinelli, Gianni, Perozek, Joshua, Palacios, Tomas, Zhang, Beijia, Herd, Jeffrey, Keast, Craig
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
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Conference Proceeding
Solid-State Qubits: 3D Integration and Packaging
Rosenberg, Danna, Weber, Steven J., Conway, David, Yost, Donna-Ruth W., Mallek, Justin, Calusine, Gregory, Das, Rabindra, Kim, David, Schwartz, Mollie E., Woods, Wayne, Yoder, Jonilyn L., Oliver, William D.
Published in IEEE microwave magazine (01.08.2020)
Published in IEEE microwave magazine (01.08.2020)
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Magazine Article
Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits
Hazard, Thomas M, Woods, Wayne, Rosenberg, Danna, Das, Rabi, Hirjibehedin, Cyrus F, Kim, David K, Knecht, Jeffery, Mallek, Justin, Melville, Alexander, Niedzielski, Bethany M, Serniak, Kyle, Sliwa, Katrina M, Ruth-Yost, Donna, Yoder, Jonilyn L, Oliver, William D, Schwartz, Mollie E
Year of Publication 01.08.2023
Year of Publication 01.08.2023
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Journal Article
Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
Suntharalingam, V., Berger, R., Burns, J.A., Chen, C.K., Keast, C.L., Knecht, J.M., Lambert, R.D., Newcomb, K.L., O'Mara, D.M., Rathman, D.D., Shaver, D.C., Soares, A.M., Stevenson, C.N., Tyrrell, B.M., Warner, K., Wheeler, B.D., Yost, D.-R.W., Young, D.J.
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
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Conference Proceeding
Electrospray devices and methods for fabricating electrospray devices
Siegel, Noah, Lozano, Paulo C, Smith, Melissa Alyson, Yost, Donna-Ruth, Freeman, Daniel
Year of Publication 25.07.2023
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Year of Publication 25.07.2023
Patent
Cryogenic Qubit Integration for Quantum Computing
Das, R N., Oliver, W.D., Yoder, J.L., Rosenberg, D., Kim, D.K., Yost, D., Mallek, J., Hover, D., Bolkhovsky, V., Kerman, A.J.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
ELECTROSPRAY DEVICES AND METHODS FOR FABRICATING ELECTROSPRAY DEVICES
SIEGEL, Noah, SMITH, Melissa Alyson, YOST, Donna-Ruth, FREEMAN, Daniel, LOZANO, Paulo C
Year of Publication 07.04.2022
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Year of Publication 07.04.2022
Patent
ELECTROSPRAY DEVICES AND METHODS FOR FABRICATING ELECTROSPRAY DEVICES
SIEGEL, Noah, YOST, Donna-Ruth, SMITH, Mellisa Alyson, FREEMAN, Daniel, LOZANO, Paulo C
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
ELECTROSPRAY DEVICES AND METHODS FOR FABRICATING ELECTROSPRAY DEVICES
Siegel, Noah, Lozano, Paulo C, Smith, Melissa Alyson, Yost, Donna-Ruth, Freeman, Daniel
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
Silicon Hard-Stop Spacers for 3D Integration of Superconducting Qubits
Niedzielski, Bethany M., Yoder, Jonilyn L., Ruth-Yost, Donna, Oliver, William D., Kim, David K., Schwartz, Mollie E., Rosenberg, Danna, Calusine, Greg, Das, Rabi, Melville, Alexander J., Plant, Jason, Racz, Livia
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
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Conference Proceeding
Qubit circuits with deep, in-substrate components
Hirjibehedin, Cyrus, Schwartz, Mollie, Kerman, Andrew, Mallek, Justin, Oliver, William, Yoder, Jonilyn, Woods, Wayne, Yost, Donna-Ruth, Rosenberg, Danna, Hazard, Thomas
Year of Publication 11.07.2023
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Year of Publication 11.07.2023
Patent
Fabrication of superconducting through-silicon vias
Mallek, Justin L, Yost, Donna-Ruth W, Rosenberg, Danna, Yoder, Jonilyn L, Calusine, Gregory, Cook, Matt, Das, Rabindra, Day, Alexandra, Golden, Evan, Kim, David K, Knecht, Jeffery, Niedzielski, Bethany M, Schwartz, Mollie, Sevi, Arjan, Stull, Corey, Woods, Wayne, Kerman, Andrew J, Oliver, William D
Year of Publication 15.03.2021
Year of Publication 15.03.2021
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Journal Article
Solid-state qubits integrated with superconducting through-silicon vias
Yost, Donna-Ruth W, Schwartz, Mollie E, Mallek, Justin, Rosenberg, Danna, Stull, Corey, Yoder, Jonilyn L, Calusine, Greg, Cook, Matt, Das, Rabindra, Day, Alexandra L, Golden, Evan B, Kim, David K, Melville, Alexander, Niedzielski, Bethany M, Woods, Wayne, Kerman, Andrew J, Oliver, Willam D
Published in arXiv.org (29.09.2020)
Published in arXiv.org (29.09.2020)
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Paper
Journal Article
Semiconductor surface passivation
Bolkhovsky, Vladimir, Leitz, Christopher, Yost, Donna-Ruth, Ryu, Kevin, Gregory, James, Lambert, Renee
Year of Publication 03.11.2020
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Year of Publication 03.11.2020
Patent
Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits
Hazard, Thomas M, Woods, Wayne, Rosenberg, Danna, Das, Rabi, Hirjibehedin, Cyrus F, Kim, David K, Knecht, Jeffery, Mallek, Justin, Melville, Alexander, Niedzielski, Bethany M, Serniak, Kyle, Sliwa, Katrina M, Ruth-Yost, Donna, Yoder, Jonilyn L, Oliver, William D, Schwartz, Mollie E
Published in arXiv.org (01.08.2023)
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Published in arXiv.org (01.08.2023)
Paper